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Bibliographic details for 17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)
- Page name: 17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 2 January 2024 06:20 UTC
- Date retrieved: 23 May 2024 12:03 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851
- Page Version ID: 20851
Citation styles for 17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)
APA style
17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.). (2024, January 2). WikiPatents, . Retrieved 12:03, May 23, 2024 from http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851.
MLA style
"17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 2 Jan 2024, 06:20 UTC. 23 May 2024, 12:03 <http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851>.
MHRA style
WikiPatents contributors, '17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 2 January 2024, 06:20 UTC, <http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851> [accessed 23 May 2024]
Chicago style
WikiPatents contributors, "17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851 (accessed May 23, 2024).
CBE/CSE style
WikiPatents contributors. 17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jan 2, 06:20 UTC [cited 2024 May 23]. Available from: http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851.
Bluebook style
17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851 (last visited May 23, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851", note = "[Online; accessed 23-May-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=17696989._THERMAL_PAD,_SEMICONDUCTOR_CHIP_INCLUDING_THE_SAME_AND_METHOD_OF_MANUFACTURING_THE_SEMICONDUCTOR_CHIP_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=20851}", note = "[Online; accessed 23-May-2024]" }