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Bibliographic details for 18054348. TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- Page name: 18054348. TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 2 January 2024 04:55 UTC
- Date retrieved: 8 June 2024 05:47 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18054348._TRENCH_ETCHING_PROCESS_FOR_PHOTORESIST_LINE_ROUGHNESS_IMPROVEMENT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20317
- Page Version ID: 20317
Citation styles for 18054348. TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
APA style
18054348. TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.). (2024, January 2). WikiPatents, . Retrieved 05:47, June 8, 2024 from http://wikipatents.org/index.php?title=18054348._TRENCH_ETCHING_PROCESS_FOR_PHOTORESIST_LINE_ROUGHNESS_IMPROVEMENT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20317.
MLA style
"18054348. TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)." WikiPatents, . 2 Jan 2024, 04:55 UTC. 8 Jun 2024, 05:47 <http://wikipatents.org/index.php?title=18054348._TRENCH_ETCHING_PROCESS_FOR_PHOTORESIST_LINE_ROUGHNESS_IMPROVEMENT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20317>.
MHRA style
WikiPatents contributors, '18054348. TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)', WikiPatents, , 2 January 2024, 04:55 UTC, <http://wikipatents.org/index.php?title=18054348._TRENCH_ETCHING_PROCESS_FOR_PHOTORESIST_LINE_ROUGHNESS_IMPROVEMENT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20317> [accessed 8 June 2024]
Chicago style
WikiPatents contributors, "18054348. TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18054348._TRENCH_ETCHING_PROCESS_FOR_PHOTORESIST_LINE_ROUGHNESS_IMPROVEMENT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20317 (accessed June 8, 2024).
CBE/CSE style
WikiPatents contributors. 18054348. TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) [Internet]. WikiPatents, ; 2024 Jan 2, 04:55 UTC [cited 2024 Jun 8]. Available from: http://wikipatents.org/index.php?title=18054348._TRENCH_ETCHING_PROCESS_FOR_PHOTORESIST_LINE_ROUGHNESS_IMPROVEMENT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20317.
Bluebook style
18054348. TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.), http://wikipatents.org/index.php?title=18054348._TRENCH_ETCHING_PROCESS_FOR_PHOTORESIST_LINE_ROUGHNESS_IMPROVEMENT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20317 (last visited June 8, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18054348. TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18054348._TRENCH_ETCHING_PROCESS_FOR_PHOTORESIST_LINE_ROUGHNESS_IMPROVEMENT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20317",
note = "[Online; accessed 8-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18054348. TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18054348._TRENCH_ETCHING_PROCESS_FOR_PHOTORESIST_LINE_ROUGHNESS_IMPROVEMENT_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=20317}",
note = "[Online; accessed 8-June-2024]"
}
