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Citation styles for 17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

APA style

17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.). (2024, January 2). WikiPatents, . Retrieved 11:24, June 7, 2024 from http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485.

MLA style

"17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)." WikiPatents, . 2 Jan 2024, 02:54 UTC. 7 Jun 2024, 11:24 <http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485>.

MHRA style

WikiPatents contributors, '17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)', WikiPatents, , 2 January 2024, 02:54 UTC, <http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485> [accessed 7 June 2024]

Chicago style

WikiPatents contributors, "17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485 (accessed June 7, 2024).

CBE/CSE style

WikiPatents contributors. 17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) [Internet]. WikiPatents, ; 2024 Jan 2, 02:54 UTC [cited 2024 Jun 7]. Available from: http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485.

Bluebook style

17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.), http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485 (last visited June 7, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485",
   note = "[Online; accessed 7-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17936959. METHOD FOR FORMING PACKAGE STRUCTURE WITH CAVITY SUBSTRATE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17936959._METHOD_FOR_FORMING_PACKAGE_STRUCTURE_WITH_CAVITY_SUBSTRATE_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19485}",
   note = "[Online; accessed 7-June-2024]"
 }