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Bibliographic details for 17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Page name: 17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 2 January 2024 02:23 UTC
- Date retrieved: 8 June 2024 16:56 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17827751._WIRING_SUBSTRATE,_METHOD_OF_FABRICATING_THE_SAME,_AND_METHOD_OF_FABRICATING_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=19200
- Page Version ID: 19200
Citation styles for 17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
APA style
17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, January 2). WikiPatents, . Retrieved 16:56, June 8, 2024 from http://wikipatents.org/index.php?title=17827751._WIRING_SUBSTRATE,_METHOD_OF_FABRICATING_THE_SAME,_AND_METHOD_OF_FABRICATING_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=19200.
MLA style
"17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 2 Jan 2024, 02:23 UTC. 8 Jun 2024, 16:56 <http://wikipatents.org/index.php?title=17827751._WIRING_SUBSTRATE,_METHOD_OF_FABRICATING_THE_SAME,_AND_METHOD_OF_FABRICATING_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=19200>.
MHRA style
WikiPatents contributors, '17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 2 January 2024, 02:23 UTC, <http://wikipatents.org/index.php?title=17827751._WIRING_SUBSTRATE,_METHOD_OF_FABRICATING_THE_SAME,_AND_METHOD_OF_FABRICATING_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=19200> [accessed 8 June 2024]
Chicago style
WikiPatents contributors, "17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=17827751._WIRING_SUBSTRATE,_METHOD_OF_FABRICATING_THE_SAME,_AND_METHOD_OF_FABRICATING_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=19200 (accessed June 8, 2024).
CBE/CSE style
WikiPatents contributors. 17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jan 2, 02:23 UTC [cited 2024 Jun 8]. Available from: http://wikipatents.org/index.php?title=17827751._WIRING_SUBSTRATE,_METHOD_OF_FABRICATING_THE_SAME,_AND_METHOD_OF_FABRICATING_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=19200.
Bluebook style
17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=17827751._WIRING_SUBSTRATE,_METHOD_OF_FABRICATING_THE_SAME,_AND_METHOD_OF_FABRICATING_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=19200 (last visited June 8, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=17827751._WIRING_SUBSTRATE,_METHOD_OF_FABRICATING_THE_SAME,_AND_METHOD_OF_FABRICATING_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=19200", note = "[Online; accessed 8-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "17827751. WIRING SUBSTRATE, METHOD OF FABRICATING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=17827751._WIRING_SUBSTRATE,_METHOD_OF_FABRICATING_THE_SAME,_AND_METHOD_OF_FABRICATING_SEMICONDUCTOR_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=19200}", note = "[Online; accessed 8-June-2024]" }