Cite This Page
Bibliographic details for 18206187. PROCESS OF FORMING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Page name: 18206187. PROCESS OF FORMING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 1 January 2024 06:09 UTC
- Date retrieved: 3 June 2024 14:44 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18206187._PROCESS_OF_FORMING_SILICON-CONTAINING_FILM_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=16787
- Page Version ID: 16787
Citation styles for 18206187. PROCESS OF FORMING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
APA style
18206187. PROCESS OF FORMING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, January 1). WikiPatents, . Retrieved 14:44, June 3, 2024 from http://wikipatents.org/index.php?title=18206187._PROCESS_OF_FORMING_SILICON-CONTAINING_FILM_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=16787.
MLA style
"18206187. PROCESS OF FORMING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 1 Jan 2024, 06:09 UTC. 3 Jun 2024, 14:44 <http://wikipatents.org/index.php?title=18206187._PROCESS_OF_FORMING_SILICON-CONTAINING_FILM_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=16787>.
MHRA style
WikiPatents contributors, '18206187. PROCESS OF FORMING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 1 January 2024, 06:09 UTC, <http://wikipatents.org/index.php?title=18206187._PROCESS_OF_FORMING_SILICON-CONTAINING_FILM_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=16787> [accessed 3 June 2024]
Chicago style
WikiPatents contributors, "18206187. PROCESS OF FORMING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18206187._PROCESS_OF_FORMING_SILICON-CONTAINING_FILM_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=16787 (accessed June 3, 2024).
CBE/CSE style
WikiPatents contributors. 18206187. PROCESS OF FORMING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jan 1, 06:09 UTC [cited 2024 Jun 3]. Available from: http://wikipatents.org/index.php?title=18206187._PROCESS_OF_FORMING_SILICON-CONTAINING_FILM_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=16787.
Bluebook style
18206187. PROCESS OF FORMING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18206187._PROCESS_OF_FORMING_SILICON-CONTAINING_FILM_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=16787 (last visited June 3, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18206187. PROCESS OF FORMING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18206187._PROCESS_OF_FORMING_SILICON-CONTAINING_FILM_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=16787", note = "[Online; accessed 3-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18206187. PROCESS OF FORMING SILICON-CONTAINING FILM AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18206187._PROCESS_OF_FORMING_SILICON-CONTAINING_FILM_AND_METHOD_OF_MANUFACTURING_INTEGRATED_CIRCUIT_DEVICE_USING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=16787}", note = "[Online; accessed 3-June-2024]" }