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Bibliographic details for 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)

Citation styles for 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)

APA style

17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation). (2024, January 1). WikiPatents, . Retrieved 20:57, June 9, 2024 from http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680.

MLA style

"17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)." WikiPatents, . 1 Jan 2024, 05:57 UTC. 9 Jun 2024, 20:57 <http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680>.

MHRA style

WikiPatents contributors, '17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)', WikiPatents, , 1 January 2024, 05:57 UTC, <http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680> [accessed 9 June 2024]

Chicago style

WikiPatents contributors, "17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680 (accessed June 9, 2024).

CBE/CSE style

WikiPatents contributors. 17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jan 1, 05:57 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680.

Bluebook style

17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680 (last visited June 9, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680",
   note = "[Online; accessed 9-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17846153. PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH INTEGRATED CIRCUIT DIES HAVING PLANARIZED EDGES simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17846153._PACKAGE_ARCHITECTURE_OF_THREE-DIMENSIONAL_INTERCONNECT_CUBE_WITH_INTEGRATED_CIRCUIT_DIES_HAVING_PLANARIZED_EDGES_simplified_abstract_(Intel_Corporation)&oldid=16680}",
   note = "[Online; accessed 9-June-2024]"
 }


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