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Bibliographic details for 17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation)

Citation styles for 17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation)

APA style

17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation). (2024, January 1). WikiPatents, . Retrieved 01:20, June 10, 2024 from http://wikipatents.org/index.php?title=17848069._MICROELECTRONIC_ASSEMBLIES_WITH_ANCHOR_LAYER_AROUND_A_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=16667.

MLA style

"17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation)." WikiPatents, . 1 Jan 2024, 05:56 UTC. 10 Jun 2024, 01:20 <http://wikipatents.org/index.php?title=17848069._MICROELECTRONIC_ASSEMBLIES_WITH_ANCHOR_LAYER_AROUND_A_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=16667>.

MHRA style

WikiPatents contributors, '17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation)', WikiPatents, , 1 January 2024, 05:56 UTC, <http://wikipatents.org/index.php?title=17848069._MICROELECTRONIC_ASSEMBLIES_WITH_ANCHOR_LAYER_AROUND_A_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=16667> [accessed 10 June 2024]

Chicago style

WikiPatents contributors, "17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17848069._MICROELECTRONIC_ASSEMBLIES_WITH_ANCHOR_LAYER_AROUND_A_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=16667 (accessed June 10, 2024).

CBE/CSE style

WikiPatents contributors. 17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jan 1, 05:56 UTC [cited 2024 Jun 10]. Available from: http://wikipatents.org/index.php?title=17848069._MICROELECTRONIC_ASSEMBLIES_WITH_ANCHOR_LAYER_AROUND_A_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=16667.

Bluebook style

17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17848069._MICROELECTRONIC_ASSEMBLIES_WITH_ANCHOR_LAYER_AROUND_A_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=16667 (last visited June 10, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17848069._MICROELECTRONIC_ASSEMBLIES_WITH_ANCHOR_LAYER_AROUND_A_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=16667",
   note = "[Online; accessed 10-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17848069._MICROELECTRONIC_ASSEMBLIES_WITH_ANCHOR_LAYER_AROUND_A_BRIDGE_DIE_simplified_abstract_(Intel_Corporation)&oldid=16667}",
   note = "[Online; accessed 10-June-2024]"
 }


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