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Bibliographic details for 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)
- Page name: 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 1 January 2024 05:54 UTC
- Date retrieved: 8 June 2024 23:45 UTC
- Permanent URL: http://wikipatents.org/index.php?title=17848624._SILICON_NITRIDE_LAYER_UNDER_A_COPPER_PAD_simplified_abstract_(Intel_Corporation)&oldid=16657
- Page Version ID: 16657
Citation styles for 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)
APA style
17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation). (2024, January 1). WikiPatents, . Retrieved 23:45, June 8, 2024 from http://wikipatents.org/index.php?title=17848624._SILICON_NITRIDE_LAYER_UNDER_A_COPPER_PAD_simplified_abstract_(Intel_Corporation)&oldid=16657.
MLA style
"17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)." WikiPatents, . 1 Jan 2024, 05:54 UTC. 8 Jun 2024, 23:45 <http://wikipatents.org/index.php?title=17848624._SILICON_NITRIDE_LAYER_UNDER_A_COPPER_PAD_simplified_abstract_(Intel_Corporation)&oldid=16657>.
MHRA style
WikiPatents contributors, '17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)', WikiPatents, , 1 January 2024, 05:54 UTC, <http://wikipatents.org/index.php?title=17848624._SILICON_NITRIDE_LAYER_UNDER_A_COPPER_PAD_simplified_abstract_(Intel_Corporation)&oldid=16657> [accessed 8 June 2024]
Chicago style
WikiPatents contributors, "17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17848624._SILICON_NITRIDE_LAYER_UNDER_A_COPPER_PAD_simplified_abstract_(Intel_Corporation)&oldid=16657 (accessed June 8, 2024).
CBE/CSE style
WikiPatents contributors. 17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jan 1, 05:54 UTC [cited 2024 Jun 8]. Available from: http://wikipatents.org/index.php?title=17848624._SILICON_NITRIDE_LAYER_UNDER_A_COPPER_PAD_simplified_abstract_(Intel_Corporation)&oldid=16657.
Bluebook style
17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17848624._SILICON_NITRIDE_LAYER_UNDER_A_COPPER_PAD_simplified_abstract_(Intel_Corporation)&oldid=16657 (last visited June 8, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=17848624._SILICON_NITRIDE_LAYER_UNDER_A_COPPER_PAD_simplified_abstract_(Intel_Corporation)&oldid=16657",
note = "[Online; accessed 8-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "17848624. SILICON NITRIDE LAYER UNDER A COPPER PAD simplified abstract (Intel Corporation) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=17848624._SILICON_NITRIDE_LAYER_UNDER_A_COPPER_PAD_simplified_abstract_(Intel_Corporation)&oldid=16657}",
note = "[Online; accessed 8-June-2024]"
}
