Cite This Page

Jump to navigation Jump to search

Bibliographic details for 17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation)

Citation styles for 17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation)

APA style

17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation). (2024, January 1). WikiPatents, . Retrieved 01:14, May 29, 2024 from http://wikipatents.org/index.php?title=17848053._ASYMMETRICAL_DIELECTRIC-TO-METAL_ADHESION_ARCHITECTURE_FOR_ELECTRONIC_PACKAGES_simplified_abstract_(Intel_Corporation)&oldid=16655.

MLA style

"17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation)." WikiPatents, . 1 Jan 2024, 05:54 UTC. 29 May 2024, 01:14 <http://wikipatents.org/index.php?title=17848053._ASYMMETRICAL_DIELECTRIC-TO-METAL_ADHESION_ARCHITECTURE_FOR_ELECTRONIC_PACKAGES_simplified_abstract_(Intel_Corporation)&oldid=16655>.

MHRA style

WikiPatents contributors, '17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation)', WikiPatents, , 1 January 2024, 05:54 UTC, <http://wikipatents.org/index.php?title=17848053._ASYMMETRICAL_DIELECTRIC-TO-METAL_ADHESION_ARCHITECTURE_FOR_ELECTRONIC_PACKAGES_simplified_abstract_(Intel_Corporation)&oldid=16655> [accessed 29 May 2024]

Chicago style

WikiPatents contributors, "17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17848053._ASYMMETRICAL_DIELECTRIC-TO-METAL_ADHESION_ARCHITECTURE_FOR_ELECTRONIC_PACKAGES_simplified_abstract_(Intel_Corporation)&oldid=16655 (accessed May 29, 2024).

CBE/CSE style

WikiPatents contributors. 17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jan 1, 05:54 UTC [cited 2024 May 29]. Available from: http://wikipatents.org/index.php?title=17848053._ASYMMETRICAL_DIELECTRIC-TO-METAL_ADHESION_ARCHITECTURE_FOR_ELECTRONIC_PACKAGES_simplified_abstract_(Intel_Corporation)&oldid=16655.

Bluebook style

17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17848053._ASYMMETRICAL_DIELECTRIC-TO-METAL_ADHESION_ARCHITECTURE_FOR_ELECTRONIC_PACKAGES_simplified_abstract_(Intel_Corporation)&oldid=16655 (last visited May 29, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17848053._ASYMMETRICAL_DIELECTRIC-TO-METAL_ADHESION_ARCHITECTURE_FOR_ELECTRONIC_PACKAGES_simplified_abstract_(Intel_Corporation)&oldid=16655",
   note = "[Online; accessed 29-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17848053. ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17848053._ASYMMETRICAL_DIELECTRIC-TO-METAL_ADHESION_ARCHITECTURE_FOR_ELECTRONIC_PACKAGES_simplified_abstract_(Intel_Corporation)&oldid=16655}",
   note = "[Online; accessed 29-May-2024]"
 }


Retrieved from "http://wikipatents.org/index.php?title=Special:CiteThisPage"