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Bibliographic details for 17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)

Citation styles for 17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)

APA style

17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation). (2024, January 1). WikiPatents, . Retrieved 00:07, June 10, 2024 from http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653.

MLA style

"17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)." WikiPatents, . 1 Jan 2024, 05:54 UTC. 10 Jun 2024, 00:07 <http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653>.

MHRA style

WikiPatents contributors, '17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)', WikiPatents, , 1 January 2024, 05:54 UTC, <http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653> [accessed 10 June 2024]

Chicago style

WikiPatents contributors, "17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653 (accessed June 10, 2024).

CBE/CSE style

WikiPatents contributors. 17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jan 1, 05:54 UTC [cited 2024 Jun 10]. Available from: http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653.

Bluebook style

17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653 (last visited June 10, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653",
   note = "[Online; accessed 10-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17852039. SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUBSTRATE FOR RELIABILITY PERFORMANCE ENHANCEMENT simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=17852039._SINX_ADHESION_PROMOTER_WITH_ADHESION_HOLE_FEATURES_IN_PACKAGING_SUBSTRATE_FOR_RELIABILITY_PERFORMANCE_ENHANCEMENT_simplified_abstract_(Intel_Corporation)&oldid=16653}",
   note = "[Online; accessed 10-June-2024]"
 }


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