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Bibliographic details for 18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2023, December 14). WikiPatents, . Retrieved 03:46, June 9, 2024 from http://wikipatents.org/index.php?title=18151758._Methods_of_Forming_Packages_and_Resulting_Structures_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16174.

MLA style

"18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 14 Dec 2023, 12:43 UTC. 9 Jun 2024, 03:46 <http://wikipatents.org/index.php?title=18151758._Methods_of_Forming_Packages_and_Resulting_Structures_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16174>.

MHRA style

WikiPatents contributors, '18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 14 December 2023, 12:43 UTC, <http://wikipatents.org/index.php?title=18151758._Methods_of_Forming_Packages_and_Resulting_Structures_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16174> [accessed 9 June 2024]

Chicago style

WikiPatents contributors, "18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18151758._Methods_of_Forming_Packages_and_Resulting_Structures_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16174 (accessed June 9, 2024).

CBE/CSE style

WikiPatents contributors. 18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2023 Dec 14, 12:43 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=18151758._Methods_of_Forming_Packages_and_Resulting_Structures_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16174.

Bluebook style

18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18151758._Methods_of_Forming_Packages_and_Resulting_Structures_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16174 (last visited June 9, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=18151758._Methods_of_Forming_Packages_and_Resulting_Structures_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16174",
   note = "[Online; accessed 9-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18151758. Methods of Forming Packages and Resulting Structures simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=18151758._Methods_of_Forming_Packages_and_Resulting_Structures_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16174}",
   note = "[Online; accessed 9-June-2024]"
 }


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