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Bibliographic details for 17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2023, December 14). WikiPatents, . Retrieved 07:21, June 9, 2024 from http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125.

MLA style

"17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 14 Dec 2023, 12:36 UTC. 9 Jun 2024, 07:21 <http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125>.

MHRA style

WikiPatents contributors, '17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 14 December 2023, 12:36 UTC, <http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125> [accessed 9 June 2024]

Chicago style

WikiPatents contributors, "17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125 (accessed June 9, 2024).

CBE/CSE style

WikiPatents contributors. 17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2023 Dec 14, 12:36 UTC [cited 2024 Jun 9]. Available from: http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125.

Bluebook style

17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125 (last visited June 9, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125",
   note = "[Online; accessed 9-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17822867. Polishing Pad for Chemical Mechanical Polishing and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=17822867._Polishing_Pad_for_Chemical_Mechanical_Polishing_and_Method_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=16125}",
   note = "[Online; accessed 9-June-2024]"
 }


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