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Bibliographic details for 17830224. MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)

Citation styles for 17830224. MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)

APA style

17830224. MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.). (2023, December 11). WikiPatents, . Retrieved 01:56, May 29, 2024 from http://wikipatents.org/index.php?title=17830224._MODULAR_CONSTRUCTION_OF_HYBRID-BONDED_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15875.

MLA style

"17830224. MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)." WikiPatents, . 11 Dec 2023, 06:06 UTC. 29 May 2024, 01:56 <http://wikipatents.org/index.php?title=17830224._MODULAR_CONSTRUCTION_OF_HYBRID-BONDED_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15875>.

MHRA style

WikiPatents contributors, '17830224. MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)', WikiPatents, , 11 December 2023, 06:06 UTC, <http://wikipatents.org/index.php?title=17830224._MODULAR_CONSTRUCTION_OF_HYBRID-BONDED_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15875> [accessed 29 May 2024]

Chicago style

WikiPatents contributors, "17830224. MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=17830224._MODULAR_CONSTRUCTION_OF_HYBRID-BONDED_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15875 (accessed May 29, 2024).

CBE/CSE style

WikiPatents contributors. 17830224. MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.) [Internet]. WikiPatents, ; 2023 Dec 11, 06:06 UTC [cited 2024 May 29]. Available from: http://wikipatents.org/index.php?title=17830224._MODULAR_CONSTRUCTION_OF_HYBRID-BONDED_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15875.

Bluebook style

17830224. MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.), http://wikipatents.org/index.php?title=17830224._MODULAR_CONSTRUCTION_OF_HYBRID-BONDED_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15875 (last visited May 29, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17830224. MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=17830224._MODULAR_CONSTRUCTION_OF_HYBRID-BONDED_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15875",
   note = "[Online; accessed 29-May-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "17830224. MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=17830224._MODULAR_CONSTRUCTION_OF_HYBRID-BONDED_SEMICONDUCTOR_DIE_ASSEMBLIES_AND_RELATED_SYSTEMS_AND_METHODS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15875}",
   note = "[Online; accessed 29-May-2024]"
 }


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