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Bibliographic details for 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)
- Page name: 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 11 December 2023 06:04 UTC
- Date retrieved: 1 June 2024 00:06 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862
- Page Version ID: 15862
Citation styles for 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)
APA style
18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.). (2023, December 11). WikiPatents, . Retrieved 00:06, June 1, 2024 from http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862.
MLA style
"18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)." WikiPatents, . 11 Dec 2023, 06:04 UTC. 1 Jun 2024, 00:06 <http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862>.
MHRA style
WikiPatents contributors, '18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)', WikiPatents, , 11 December 2023, 06:04 UTC, <http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862> [accessed 1 June 2024]
Chicago style
WikiPatents contributors, "18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.)," WikiPatents, , http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862 (accessed June 1, 2024).
CBE/CSE style
WikiPatents contributors. 18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.) [Internet]. WikiPatents, ; 2023 Dec 11, 06:04 UTC [cited 2024 Jun 1]. Available from: http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862.
Bluebook style
18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.), http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862 (last visited June 1, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ", year = "2023", url = "http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862", note = "[Online; accessed 1-June-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18454703. METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS simplified abstract (Micron Technology, Inc.) --- WikiPatents{,} ", year = "2023", url = "\url{http://wikipatents.org/index.php?title=18454703._METHODS_OF_MANUFACTURING_STACKED_SEMICONDUCTOR_DIE_ASSEMBLIES_WITH_HIGH_EFFICIENCY_THERMAL_PATHS_simplified_abstract_(Micron_Technology,_Inc.)&oldid=15862}", note = "[Online; accessed 1-June-2024]" }