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Bibliographic details for US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract

Citation styles for US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract

APA style

US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract. (2023, December 6). WikiPatents, . Retrieved 08:22, June 2, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18230829._Method_of_Forming_Semiconductor_Packages_Having_Through_Package_Vias_simplified_abstract&oldid=15549.

MLA style

"US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract." WikiPatents, . 6 Dec 2023, 15:33 UTC. 2 Jun 2024, 08:22 <http://wikipatents.org/index.php?title=US_Patent_Application_18230829._Method_of_Forming_Semiconductor_Packages_Having_Through_Package_Vias_simplified_abstract&oldid=15549>.

MHRA style

WikiPatents contributors, 'US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract', WikiPatents, , 6 December 2023, 15:33 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18230829._Method_of_Forming_Semiconductor_Packages_Having_Through_Package_Vias_simplified_abstract&oldid=15549> [accessed 2 June 2024]

Chicago style

WikiPatents contributors, "US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18230829._Method_of_Forming_Semiconductor_Packages_Having_Through_Package_Vias_simplified_abstract&oldid=15549 (accessed June 2, 2024).

CBE/CSE style

WikiPatents contributors. US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract [Internet]. WikiPatents, ; 2023 Dec 6, 15:33 UTC [cited 2024 Jun 2]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18230829._Method_of_Forming_Semiconductor_Packages_Having_Through_Package_Vias_simplified_abstract&oldid=15549.

Bluebook style

US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18230829._Method_of_Forming_Semiconductor_Packages_Having_Through_Package_Vias_simplified_abstract&oldid=15549 (last visited June 2, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=US_Patent_Application_18230829._Method_of_Forming_Semiconductor_Packages_Having_Through_Package_Vias_simplified_abstract&oldid=15549",
   note = "[Online; accessed 2-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18230829. Method of Forming Semiconductor Packages Having Through Package Vias simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18230829._Method_of_Forming_Semiconductor_Packages_Having_Through_Package_Vias_simplified_abstract&oldid=15549}",
   note = "[Online; accessed 2-June-2024]"
 }


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