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Bibliographic details for US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract
- Page name: US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 6 December 2023 08:40 UTC
- Date retrieved: 2 June 2024 11:22 UTC
- Permanent URL: http://wikipatents.org/index.php?title=US_Patent_Application_18446732._SEMICONDUCTOR_DIE_PACKAGE_AND_METHOD_OF_MANUFACTURE_simplified_abstract&oldid=14663
- Page Version ID: 14663
Citation styles for US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract
APA style
US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract. (2023, December 6). WikiPatents, . Retrieved 11:22, June 2, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18446732._SEMICONDUCTOR_DIE_PACKAGE_AND_METHOD_OF_MANUFACTURE_simplified_abstract&oldid=14663.
MLA style
"US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract." WikiPatents, . 6 Dec 2023, 08:40 UTC. 2 Jun 2024, 11:22 <http://wikipatents.org/index.php?title=US_Patent_Application_18446732._SEMICONDUCTOR_DIE_PACKAGE_AND_METHOD_OF_MANUFACTURE_simplified_abstract&oldid=14663>.
MHRA style
WikiPatents contributors, 'US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract', WikiPatents, , 6 December 2023, 08:40 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18446732._SEMICONDUCTOR_DIE_PACKAGE_AND_METHOD_OF_MANUFACTURE_simplified_abstract&oldid=14663> [accessed 2 June 2024]
Chicago style
WikiPatents contributors, "US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18446732._SEMICONDUCTOR_DIE_PACKAGE_AND_METHOD_OF_MANUFACTURE_simplified_abstract&oldid=14663 (accessed June 2, 2024).
CBE/CSE style
WikiPatents contributors. US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract [Internet]. WikiPatents, ; 2023 Dec 6, 08:40 UTC [cited 2024 Jun 2]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18446732._SEMICONDUCTOR_DIE_PACKAGE_AND_METHOD_OF_MANUFACTURE_simplified_abstract&oldid=14663.
Bluebook style
US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18446732._SEMICONDUCTOR_DIE_PACKAGE_AND_METHOD_OF_MANUFACTURE_simplified_abstract&oldid=14663 (last visited June 2, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "http://wikipatents.org/index.php?title=US_Patent_Application_18446732._SEMICONDUCTOR_DIE_PACKAGE_AND_METHOD_OF_MANUFACTURE_simplified_abstract&oldid=14663",
note = "[Online; accessed 2-June-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "US Patent Application 18446732. SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE simplified abstract --- WikiPatents{,} ",
year = "2023",
url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18446732._SEMICONDUCTOR_DIE_PACKAGE_AND_METHOD_OF_MANUFACTURE_simplified_abstract&oldid=14663}",
note = "[Online; accessed 2-June-2024]"
}
