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Show new changes starting from 14:41, 8 June 2024
   
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6 June 2024

N    05:55  18368128. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)‎ diffhist +4,247‎ Wikipatents talk contribs Creating a new page
N    05:55  18071797. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)‎ diffhist +3,745‎ Wikipatents talk contribs Creating a new page
N    05:40  18526964. SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Lodestar Licensing Group LLC)‎ diffhist +3,946‎ Wikipatents talk contribs Creating a new page
N    04:50  18090608. MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.)‎ diffhist +4,144‎ Wikipatents talk contribs Creating a new page
N    03:53  18502105. CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF simplified abstract (MEDIATEK Inc.)‎ diffhist +3,484‎ Wikipatents talk contribs Creating a new page
N    03:53  18388275. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (MEDIATEK Inc.)‎ diffhist +4,684‎ Wikipatents talk contribs Creating a new page
N    03:31  18216860. CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)‎ diffhist +3,288‎ Wikipatents talk contribs Creating a new page
N    03:22  18434842. RADIO-FREQUENCY MODULE simplified abstract (Murata Manufacturing Co., Ltd.)‎ diffhist +4,056‎ Wikipatents talk contribs Creating a new page
N    02:39  18071972. MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD simplified abstract (TEXAS INSTRUMENTS INCORPORATED)‎ diffhist +3,872‎ Wikipatents talk contribs Creating a new page
N    02:39  18070708. ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCONNECT simplified abstract (TEXAS INSTRUMENTS INCORPORATED)‎ diffhist +4,602‎ Wikipatents talk contribs Creating a new page
N    02:39  18071164. WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE simplified abstract (TEXAS INSTRUMENTS INCORPORATED)‎ diffhist +3,692‎ Wikipatents talk contribs Creating a new page
N    02:22  18166450. INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +5,079‎ Wikipatents talk contribs Creating a new page
N    02:22  18409620. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +4,920‎ Wikipatents talk contribs Creating a new page
N    02:18  18435822. APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract (Micron Technology, Inc.)‎ diffhist +3,379‎ Wikipatents talk contribs Creating a new page
N    02:11  18059089. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation)‎ diffhist +4,807‎ Wikipatents talk contribs Creating a new page
N    02:11  18060125. INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract (Intel Corporation)‎ diffhist +3,904‎ Wikipatents talk contribs Creating a new page
N    02:11  18071257. SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE simplified abstract (Intel Corporation)‎ diffhist +3,110‎ Wikipatents talk contribs Creating a new page
N    02:11  18071901. OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT simplified abstract (Intel Corporation)‎ diffhist +3,764‎ Wikipatents talk contribs Creating a new page
N    02:11  18060080. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)‎ diffhist +4,775‎ Wikipatents talk contribs Creating a new page
N    02:11  18071116. RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract (Intel Corporation)‎ diffhist +3,099‎ Wikipatents talk contribs Creating a new page
N    02:10  18060106. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)‎ diffhist +3,493‎ Wikipatents talk contribs Creating a new page
N    02:00  18134933. POWER MODULE simplified abstract (Kia Corporation)‎ diffhist +3,381‎ Wikipatents talk contribs Creating a new page
N    01:54  18134933. POWER MODULE simplified abstract (Hyundai Motor Company)‎ diffhist +3,280‎ Wikipatents talk contribs Creating a new page
N    01:21  18430903. CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)‎ diffhist +4,283‎ Wikipatents talk contribs Creating a new page
N    01:21  18437428. PACKAGE STRUCTURE AND ELECTRONIC APPARATUS simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)‎ diffhist +4,771‎ Wikipatents talk contribs Creating a new page
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