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Show new changes starting from 03:11, 29 May 2024
   
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24 May 2024

N    08:13  18318480. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.) diffhist +3,949 Wikipatents talk contribs Creating a new page
N    08:09  18315432. SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT simplified abstract (SK hynix Inc.) diffhist +3,496 Wikipatents talk contribs Creating a new page
N    07:32  18416508. TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation) diffhist +5,330 Wikipatents talk contribs Creating a new page
N    07:31  18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation) diffhist +4,766 Wikipatents talk contribs Creating a new page
N    07:24  17781013. METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.) diffhist +3,657 Wikipatents talk contribs Creating a new page
N    07:11  18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) diffhist +3,719 Wikipatents talk contribs Creating a new page
N    07:11  18415086. RESISTOR WITHIN A VIA simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) diffhist +3,425 Wikipatents talk contribs Creating a new page
N    07:11  18421552. DIAGONAL VIA MANUFACTURING METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) diffhist +3,947 Wikipatents talk contribs Creating a new page
N    07:10  18405040. SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) diffhist +4,677 Wikipatents talk contribs Creating a new page
N    07:07  18421602. TEMPERATURE MONITORING DEVICE AND METHOD simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) diffhist +3,973 Wikipatents talk contribs Creating a new page
N    03:16  18054187. METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION) diffhist +4,273 Wikipatents talk contribs Creating a new page
N    02:36  18418720. NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) diffhist +4,368 Wikipatents talk contribs Creating a new page
N    02:35  18355450. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.) diffhist +3,981 Wikipatents talk contribs Creating a new page
N    02:25  18462010. SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD simplified abstract (Samsung Electronics Co., Ltd.) diffhist +4,378 Wikipatents talk contribs Creating a new page
N    02:04  SK hynix Inc. patent applications on May 16th, 2024 diffhist +41,400 Wikipatents talk contribs Creating a new page
N    02:03  Sk hynix inc. (20240162149). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE simplified abstract diffhist +3,563 Wikipatents talk contribs Creating a new page
N    02:00  Sk hynix inc. (20240159823). SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT simplified abstract diffhist +3,644 Wikipatents talk contribs Creating a new page
N    01:21  Intel Corporation patent applications on May 16th, 2024 diffhist +60,793 Wikipatents talk contribs Creating a new page
N    01:17  Intel corporation (20240162332). TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract diffhist +5,007 Wikipatents talk contribs Creating a new page
N    01:17  Intel corporation (20240162141). SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract diffhist +4,391 Wikipatents talk contribs Creating a new page
N    01:13  BOE TECHNOLOGY GROUP CO., LTD. patent applications on May 16th, 2024 diffhist +25,222 Wikipatents talk contribs Creating a new page
N    01:10  Boe technology group co., ltd. (20240162138). METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE simplified abstract diffhist +3,401 Wikipatents talk contribs Creating a new page
N    00:59  Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on May 16th, 2024 diffhist +74,240 Wikipatents talk contribs Creating a new page
N    00:56  Taiwan semiconductor manufacturing co., ltd. (20240162172). SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract diffhist +3,944 Wikipatents talk contribs Creating a new page
N    00:56  Taiwan semiconductor manufacturing co., ltd. (20240162145). RESISTOR WITHIN A VIA simplified abstract diffhist +3,539 Wikipatents talk contribs Creating a new page
N    00:55  Taiwan semiconductor manufacturing co., ltd. (20240162142). DIAGONAL VIA MANUFACTURING METHOD simplified abstract diffhist +3,888 Wikipatents talk contribs Creating a new page
N    00:55  Taiwan semiconductor manufacturing co., ltd. (20240162094). SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract diffhist +4,497 Wikipatents talk contribs Creating a new page
N    00:52  Taiwan semiconductor manufacturing co., ltd. (20240159599). TEMPERATURE MONITORING DEVICE AND METHOD simplified abstract diffhist +4,312 Wikipatents talk contribs Creating a new page

23 May 2024

N    09:01  INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 16th, 2024 diffhist +94,365 Wikipatents talk contribs Creating a new page
N    08:56  International business machines corporation (20240162139). METHOD AND STRUCTURE OF FORMING BARRIER-LESS SKIP VIA WITH SUBTRACTIVE METAL PATTERNING simplified abstract diffhist +3,816 Wikipatents talk contribs Creating a new page
N    08:06  Samsung Electronics Co., Ltd. patent applications on May 16th, 2024 diffhist +247,085 Wikipatents talk contribs Creating a new page
N    08:05  Samsung electronics co., ltd. (20240164103). NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract diffhist +4,165 Wikipatents talk contribs Creating a new page
N    08:05  Samsung electronics co., ltd. (20240164101). THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract diffhist +4,238 Wikipatents talk contribs Creating a new page
N    07:50  Samsung electronics co., ltd. (20240162104). SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP MANUFACTURING METHOD simplified abstract diffhist +4,549 Wikipatents talk contribs Creating a new page
N    02:46  Blockchain patent applications on May 16th, 2024 diffhist +306,326 Wikipatents talk contribs Creating a new page