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Show new changes starting from 19:46, 28 May 2024
   
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24 May 2024

N    08:18  18513167. Asymmetric Stackup Structure for SoC Package Substrates simplified abstract (Apple Inc.)‎ diffhist +4,015‎ Wikipatents talk contribs Creating a new page
N    08:07  18516711. SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM simplified abstract (Google LLC)‎ diffhist +4,222‎ Wikipatents talk contribs Creating a new page
N    07:31  18054211. PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract (Intel Corporation)‎ diffhist +3,829‎ Wikipatents talk contribs Creating a new page
N    07:31  18055605. PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract (Intel Corporation)‎ diffhist +4,642‎ Wikipatents talk contribs Creating a new page
N    07:31  17988051. BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract (Intel Corporation)‎ diffhist +3,794‎ Wikipatents talk contribs Creating a new page
N    07:31  18418154. VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES simplified abstract (Intel Corporation)‎ diffhist +5,224‎ Wikipatents talk contribs Creating a new page
N    07:12  18422220. DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)‎ diffhist +4,095‎ Wikipatents talk contribs Creating a new page
N    07:11  18422550. THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)‎ diffhist +4,361‎ Wikipatents talk contribs Creating a new page
N    02:36  18418720. NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +4,368‎ Wikipatents talk contribs Creating a new page
N    02:27  18421198. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +4,712‎ Wikipatents talk contribs Creating a new page
N    02:27  18486831. SEMICONDUCTOR PACKAGES simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +3,919‎ Wikipatents talk contribs Creating a new page
N    02:26  18215292. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +4,691‎ Wikipatents talk contribs Creating a new page
N    02:26  18423229. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +4,575‎ Wikipatents talk contribs Creating a new page
N    02:26  18384152. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +4,012‎ Wikipatents talk contribs Creating a new page
N    02:26  18223757. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +4,640‎ Wikipatents talk contribs Creating a new page
N    02:26  18216157. SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +4,217‎ Wikipatents talk contribs Creating a new page
N    02:26  18218322. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +3,917‎ Wikipatents talk contribs Creating a new page
N    01:59  Google LLC patent applications on May 16th, 2024‎ diffhist +60,127‎ Wikipatents talk contribs Creating a new page
N    01:58  Google llc (20240162050). SIGNAL DISTRIBUTION FOR A QUANTUM COMPUTING SYSTEM simplified abstract‎ diffhist +4,140‎ Wikipatents talk contribs Creating a new page
N    01:21  Intel Corporation patent applications on May 16th, 2024‎ diffhist +60,793‎ Wikipatents talk contribs Creating a new page
N    01:17  Intel corporation (20240162191). PACKAGE SUBSTRATE WITH ALTERNATING DIELECTRIC MATERIAL LAYER PAIRS simplified abstract‎ diffhist +4,065‎ Wikipatents talk contribs Creating a new page
N    01:17  Intel corporation (20240162158). PACKAGE ARCHITECTURE WITH MICROFLUIDIC CHANNELS IN GLASS SUBSTRATES simplified abstract‎ diffhist +4,806‎ Wikipatents talk contribs Creating a new page
N    01:17  Intel corporation (20240162157). BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract‎ diffhist +4,096‎ Wikipatents talk contribs Creating a new page
N    01:17  Intel corporation (20240162134). VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES simplified abstract‎ diffhist +5,558‎ Wikipatents talk contribs Creating a new page
N    00:59  Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on May 16th, 2024‎ diffhist +74,240‎ Wikipatents talk contribs Creating a new page
N    00:56  Taiwan semiconductor manufacturing co., ltd. (20240162183). DIE ATTACHED LEVELING CONTROL BY METAL STOPPER BUMPS simplified abstract‎ diffhist +3,782‎ Wikipatents talk contribs Creating a new page
N    00:56  Taiwan semiconductor manufacturing co., ltd. (20240162166). THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES simplified abstract‎ diffhist +3,848‎ Wikipatents talk contribs Creating a new page

23 May 2024

N    08:06  Samsung Electronics Co., Ltd. patent applications on May 16th, 2024‎ diffhist +247,085‎ Wikipatents talk contribs Creating a new page
N    08:05  Samsung electronics co., ltd. (20240164103). NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract‎ diffhist +4,165‎ Wikipatents talk contribs Creating a new page
N    07:52  Samsung electronics co., ltd. (20240162194). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract‎ diffhist +4,661‎ Wikipatents talk contribs Creating a new page
N    07:52  Samsung electronics co., ltd. (20240162181). SEMICONDUCTOR PACKAGES simplified abstract‎ diffhist +4,155‎ Wikipatents talk contribs Creating a new page
N    07:51  Samsung electronics co., ltd. (20240162135). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract‎ diffhist +4,919‎ Wikipatents talk contribs Creating a new page
N    07:51  Samsung electronics co., ltd. (20240162133). SEMICONDUCTOR PACKAGE simplified abstract‎ diffhist +4,217‎ Wikipatents talk contribs Creating a new page
N    07:51  Samsung electronics co., ltd. (20240162132). FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract‎ diffhist +3,229‎ Wikipatents talk contribs Creating a new page
N    07:51  Samsung electronics co., ltd. (20240162130). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract‎ diffhist +4,758‎ Wikipatents talk contribs Creating a new page
N    07:50  Samsung electronics co., ltd. (20240162127). SEMICONDUCTOR PACKAGES HAVING DUMMY POSTS simplified abstract‎ diffhist +3,794‎ Wikipatents talk contribs Creating a new page
N    07:50  Samsung electronics co., ltd. (20240162115). SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME simplified abstract‎ diffhist +3,257‎ Wikipatents talk contribs Creating a new page
N    02:46  Quantum Computing patent applications on May 16th, 2024‎ diffhist +15,010‎ Wikipatents talk contribs Creating a new page
N    02:42  Apple Inc. patent applications on May 16th, 2024‎ diffhist +52,629‎ Wikipatents talk contribs Creating a new page
N    02:39  Apple inc. (20240162182). Asymmetric Stackup Structure for SoC Package Substrates simplified abstract‎ diffhist +3,518‎ Wikipatents talk contribs Creating a new page
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