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6 June 2024
N 05:55 | 18368128. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION) diffhist +4,247 Wikipatents talk contribs Creating a new page |
N 05:55 | 18071797. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION) diffhist +3,745 Wikipatents talk contribs Creating a new page |
N 05:40 | 18526964. SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATED SYSTEMS AND METHODS simplified abstract (Lodestar Licensing Group LLC) diffhist +3,946 Wikipatents talk contribs Creating a new page |
N 04:50 | 18090608. MEMORY SYSTEM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Yangtze Memory Technologies Co., Ltd.) diffhist +4,144 Wikipatents talk contribs Creating a new page |
N 03:53 | 18502105. CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF simplified abstract (MEDIATEK Inc.) diffhist +3,484 Wikipatents talk contribs Creating a new page |
N 03:53 | 18388275. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME simplified abstract (MEDIATEK Inc.) diffhist +4,684 Wikipatents talk contribs Creating a new page |
N 03:31 | 18216860. CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) diffhist +3,288 Wikipatents talk contribs Creating a new page |
N 03:22 | 18434842. RADIO-FREQUENCY MODULE simplified abstract (Murata Manufacturing Co., Ltd.) diffhist +4,056 Wikipatents talk contribs Creating a new page |
N 02:39 | 18071972. MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD simplified abstract (TEXAS INSTRUMENTS INCORPORATED) diffhist +3,872 Wikipatents talk contribs Creating a new page |
N 02:39 | 18070708. ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCONNECT simplified abstract (TEXAS INSTRUMENTS INCORPORATED) diffhist +4,602 Wikipatents talk contribs Creating a new page |
N 02:39 | 18071164. WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE simplified abstract (TEXAS INSTRUMENTS INCORPORATED) diffhist +3,692 Wikipatents talk contribs Creating a new page |
N 02:22 | 18166450. INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) diffhist +5,079 Wikipatents talk contribs Creating a new page |
N 02:22 | 18409620. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) diffhist +4,920 Wikipatents talk contribs Creating a new page |
N 02:18 | 18435822. APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract (Micron Technology, Inc.) diffhist +3,379 Wikipatents talk contribs Creating a new page |
N 02:11 | 18059089. PHOTONIC INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH GLASS CORES simplified abstract (Intel Corporation) diffhist +4,807 Wikipatents talk contribs Creating a new page |
N 02:11 | 18060125. INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract (Intel Corporation) diffhist +3,904 Wikipatents talk contribs Creating a new page |
N 02:11 | 18071257. SHAPE MEMORY POLYMER (SMP) GLASS CORE PACKAGE FOR MODULATING WARPAGE simplified abstract (Intel Corporation) diffhist +3,110 Wikipatents talk contribs Creating a new page |
N 02:11 | 18071901. OVERLYING FIDUCIAL DESIGN FOR GLASS PLACEMENT ACCURACY IMPROVEMENT simplified abstract (Intel Corporation) diffhist +3,764 Wikipatents talk contribs Creating a new page |
N 02:11 | 18060080. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation) diffhist +4,775 Wikipatents talk contribs Creating a new page |
N 02:11 | 18071116. RBTV IMPROVEMENT FOR GLASS CORE ARCHITECTURES simplified abstract (Intel Corporation) diffhist +3,099 Wikipatents talk contribs Creating a new page |
N 02:10 | 18060106. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation) diffhist +3,493 Wikipatents talk contribs Creating a new page |
N 02:00 | 18134933. POWER MODULE simplified abstract (Kia Corporation) diffhist +3,381 Wikipatents talk contribs Creating a new page |
N 01:54 | 18134933. POWER MODULE simplified abstract (Hyundai Motor Company) diffhist +3,280 Wikipatents talk contribs Creating a new page |
N 01:21 | 18430903. CHIP PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF, AND ELECTRONIC DEVICE simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.) diffhist +4,283 Wikipatents talk contribs Creating a new page |
N 01:21 | 18437428. PACKAGE STRUCTURE AND ELECTRONIC APPARATUS simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.) diffhist +4,771 Wikipatents talk contribs Creating a new page |