Difference between revisions of "Dell products l.p. (20240138105). SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING simplified abstract"

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Latest revision as of 03:05, 26 April 2024

SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING

Organization Name

dell products l.p.

Inventor(s)

Tyler Baxter Duncan of Austin TX (US)

Anthony Middleton of Cedar Park TX (US)

SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240138105 titled 'SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING

Simplified Explanation

The abstract describes an information handling system with a computing device housed in a chassis, where a heating component increases the temperature of a portion of the airflow to thermally manage the computing component.

  • The information handling system includes a computing device with a computing component housed in a chassis.
  • A heating component is used to increase the temperature of a portion of the airflow when active.
  • The heated airflow helps reduce the temperature of the computing component for thermal management.
  • Airflow is received by the chassis through an air receiving exchange and exhausted via an air expelling exchange.

Potential Applications

This technology could be applied in data centers, server rooms, and other environments where thermal management of computing devices is crucial.

Problems Solved

This innovation helps prevent overheating of computing components, which can lead to performance issues and hardware damage.

Benefits

The system improves the overall reliability and longevity of the computing device by effectively managing its temperature.

Potential Commercial Applications

Commercial applications include server racks, networking equipment, and any other computing systems that require efficient thermal management.

Possible Prior Art

One possible prior art could be the use of traditional cooling systems such as fans or liquid cooling to manage the temperature of computing devices.

Unanswered Questions

How does the heating component affect the overall energy efficiency of the information handling system?

The energy efficiency of the system could be impacted by the heating component, as it may require additional power to operate. Further research and testing would be needed to determine the exact impact on energy consumption.

What are the potential maintenance requirements for the heating component in the long term?

Regular maintenance and monitoring of the heating component may be necessary to ensure its proper functioning and longevity. Understanding the maintenance needs of this component would be crucial for the overall reliability of the information handling system.


Original Abstract Submitted

an information handling system includes a computing device, the information handling system includes a computing component of the computing device that is housed in a chassis; and a heating component that increases a temperature of a portion of an airflow when the heating component is in an active state, the portion of the airflow thermally manages the computing component by reducing a temperature of the computing component. the airflow is received by the chassis via an air receiving exchange, and exhausted by the chassis via an air expelling exchange.