Difference between revisions of "Micron Technology, Inc. patent applications published on April 11th, 2024"
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+ | '''Summary of the patent applications from Micron Technology, Inc. on April 11th, 2024''' | ||
+ | |||
+ | Micron Technology, Inc. has recently filed patents for innovative technologies in the field of semiconductor manufacturing and memory storage devices. These patents describe methods for integrated assemblies, error detection and classification, wafer-level packaging of solid-state transducers, and semiconductor interposers with multiple redistribution structures. | ||
+ | |||
+ | Summary in bullet points: | ||
+ | * Integrated assembly with container-shaped structures and storage elements. | ||
+ | * Error detection and classification method for host devices communicating with memory devices. | ||
+ | * Wafer-level packaging method for solid-state transducers with discrete optical elements. | ||
+ | * Semiconductor interposer with multiple redistribution structures and circuit elements. | ||
+ | |||
+ | Notable applications: | ||
+ | * Semiconductor manufacturing | ||
+ | * Memory storage devices | ||
+ | * Data storage systems | ||
+ | * Communication systems | ||
+ | * Medical devices | ||
+ | * High-performance computing systems | ||
+ | * Advanced communication devices | ||
+ | * Automotive electronics | ||
+ | |||
+ | |||
+ | |||
+ | |||
==Patent applications for Micron Technology, Inc. on April 11th, 2024== | ==Patent applications for Micron Technology, Inc. on April 11th, 2024== | ||
Latest revision as of 11:05, 16 April 2024
Summary of the patent applications from Micron Technology, Inc. on April 11th, 2024
Micron Technology, Inc. has recently filed patents for innovative technologies in the field of semiconductor manufacturing and memory storage devices. These patents describe methods for integrated assemblies, error detection and classification, wafer-level packaging of solid-state transducers, and semiconductor interposers with multiple redistribution structures.
Summary in bullet points:
- Integrated assembly with container-shaped structures and storage elements.
- Error detection and classification method for host devices communicating with memory devices.
- Wafer-level packaging method for solid-state transducers with discrete optical elements.
- Semiconductor interposer with multiple redistribution structures and circuit elements.
Notable applications:
- Semiconductor manufacturing
- Memory storage devices
- Data storage systems
- Communication systems
- Medical devices
- High-performance computing systems
- Advanced communication devices
- Automotive electronics
Contents
- 1 Patent applications for Micron Technology, Inc. on April 11th, 2024
- 1.1 DYNAMIC ADAPTATION OF AUTOMOTIVE AI PROCESSING POWER AND ACTIVE SENSOR DATA (18495642)
- 1.2 A DAMPER FOR A PRINTED CIRCUIT BOARD ASSEMBLY (17962927)
- 1.3 DIE FAMILY MANAGEMENT ON A MEMORY DEVICE USING BLOCK FAMILY ERROR AVOIDANCE (18543170)
- 1.4 MASTER SLAVE MANAGED MEMORY STORAGE (18491685)
- 1.5 Message Routing in a Network-Ready Storage Product for Internal and External Processing (18544806)
- 1.6 ERROR DETECTION AND CLASSIFICATION AT A MEMORY DEVICE (17938898)
- 1.7 TEMPORARY PARITY BUFFER ALLOCATION FOR ZONES IN A PARITY GROUP (18483091)
- 1.8 SECURE FIRMWARE UPDATE THROUGH A PREDEFINED SERVER (18542440)
- 1.9 THREE-STATE PROGRAMMING OF MEMORY CELLS (18545245)
- 1.10 ENHANCED GRADIENT SEEDING SCHEME DURING A PROGRAM OPERATION IN A MEMORY SUB-SYSTEM (18545888)
- 1.11 MULTI-SAMPLED, CHARGE-SHARING THERMOMETER IN MEMORY DEVICE (18539798)
- 1.12 INTERPOSERS FOR MICROELECTRONIC DEVICES (18381061)
- 1.13 WAFER-LEVEL SOLID STATE TRANSDUCER PACKAGING TRANSDUCERS INCLUDING SEPARATORS AND ASSOCIATED SYSTEMS AND METHODS (18536073)
- 1.14 ERROR DETECTION AND CLASSIFICATION AT A HOST DEVICE (17961805)
- 1.15 Integrated Assemblies and Methods of Forming Integrated Assemblies (18545180)
Patent applications for Micron Technology, Inc. on April 11th, 2024
DYNAMIC ADAPTATION OF AUTOMOTIVE AI PROCESSING POWER AND ACTIVE SENSOR DATA (18495642)
Main Inventor
Gil Golov
A DAMPER FOR A PRINTED CIRCUIT BOARD ASSEMBLY (17962927)
Main Inventor
Kaleb A. Wilson
DIE FAMILY MANAGEMENT ON A MEMORY DEVICE USING BLOCK FAMILY ERROR AVOIDANCE (18543170)
Main Inventor
Steven Michael Kientz
MASTER SLAVE MANAGED MEMORY STORAGE (18491685)
Main Inventor
Gil Golov
Message Routing in a Network-Ready Storage Product for Internal and External Processing (18544806)
Main Inventor
Luca Bert
ERROR DETECTION AND CLASSIFICATION AT A MEMORY DEVICE (17938898)
Main Inventor
Aaron P. Boehm
TEMPORARY PARITY BUFFER ALLOCATION FOR ZONES IN A PARITY GROUP (18483091)
Main Inventor
Kishore Kumar Muchherla
SECURE FIRMWARE UPDATE THROUGH A PREDEFINED SERVER (18542440)
Main Inventor
Zhan Liu
THREE-STATE PROGRAMMING OF MEMORY CELLS (18545245)
Main Inventor
Hernan A. Castro
ENHANCED GRADIENT SEEDING SCHEME DURING A PROGRAM OPERATION IN A MEMORY SUB-SYSTEM (18545888)
Main Inventor
Vinh Q. Diep
MULTI-SAMPLED, CHARGE-SHARING THERMOMETER IN MEMORY DEVICE (18539798)
Main Inventor
Agostino Macerola
INTERPOSERS FOR MICROELECTRONIC DEVICES (18381061)
Main Inventor
Owen Fay
WAFER-LEVEL SOLID STATE TRANSDUCER PACKAGING TRANSDUCERS INCLUDING SEPARATORS AND ASSOCIATED SYSTEMS AND METHODS (18536073)
Main Inventor
Vladimir Odnoblyudov
ERROR DETECTION AND CLASSIFICATION AT A HOST DEVICE (17961805)
Main Inventor
Aaron P. Boehm
Integrated Assemblies and Methods of Forming Integrated Assemblies (18545180)
Main Inventor
David K. Hwang