Difference between revisions of "SUMITOMO ELECTRIC INDUSTRIES, LTD. patent applications published on November 30th, 2023"

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'''Summary of the patent applications from SUMITOMO ELECTRIC INDUSTRIES, LTD. on November 30th, 2023'''
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SUMITOMO ELECTRIC INDUSTRIES, LTD. has recently filed several patents related to various technologies. These patents cover areas such as optical modules, shield connectors, optical connector modules, optical receivers, coupling members, synthetic single crystal diamonds, diamond sintered materials, fluorine-containing silica glass, and service hole covers for vehicle door panels.
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In the field of optical modules, one patent application describes an optical module that includes an optical semiconductor element, a stem with signal and ground pins, and a circuit board. The circuit board has signal and ground through-holes that are pierced by the respective pins, and the signal line on the board is electrically connected to the signal pin. The aim of this patent is to improve the shielding performance of the module.
 +
 +
Another patent application focuses on shield connectors, aiming to simplify their design while maintaining their shielding performance. The shield connector includes a dielectric, an inner conductor, and an outer conductor made of a metal plate material. The outer conductor consists of a box-shaped body portion and a receptacle, and a mating outer conductor can fit into the receptacle.
 +
 +
In the field of optical connector modules, a patent application describes a connector designed to be connected to an optical component in a specific direction. A connecting member is included to maintain the connected state between the connector and the optical component, and it can rotate in contact with the connector while being engaged with both the connector and the optical component.
 +
 +
In the area of optical receivers, a patent application describes a receiver that includes a beam reducer and a light receiving element. The beam reducer consists of an incident lens and an emitting lens, and the receiver's main body is located between them. The light receiving element includes a light receiving lens and a light receiving portion for further processing the received light.
 +
 +
Other patent applications cover topics such as coupling members used to connect optical components to connectors, synthetic single crystal diamonds with specific boron atom compositions, diamond sintered materials with high diamond grain content and specific dislocation densities, methods for producing fluorine-containing silica glass, and service hole covers for vehicle door panels.
 +
 +
Notable applications:
 +
* Optical module with improved shielding performance
 +
* Simplified design of shield connectors while maintaining shielding performance
 +
* Optical connector module with a connecting member for maintaining a connected state
 +
* Optical receiver with a beam reducer and a light receiving element
 +
* Coupling member for connecting optical components to connectors
 +
* Synthetic single crystal diamonds with specific boron atom compositions
 +
* Diamond sintered materials with high diamond grain content and specific dislocation densities
 +
* Method for producing fluorine-containing silica glass
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* Service hole cover for vehicle door panels.
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 +
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==Patent applications for SUMITOMO ELECTRIC INDUSTRIES, LTD. on November 30th, 2023==
 
==Patent applications for SUMITOMO ELECTRIC INDUSTRIES, LTD. on November 30th, 2023==
  
Line 8: Line 36:
 
Koji YAMAGUCHI
 
Koji YAMAGUCHI
  
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−
'''Brief explanation'''
 
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The patent application describes a service hole cover for a vehicle door panel.
 
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* The service hole cover is designed to cover a service hole in the inner panel of the door.
 
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* It consists of a cover body part that covers the service hole.
 
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* The cover body part has at least one catching part that protrudes from it towards the inner panel.
 
−
* The catching part is designed to be caught on the inner panel while allowing at least a part of the service hole to remain open.
 
−
 
−
'''Abstract'''
 
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Provided is a service hole cover covering a service hole formed in an inner panel in a vehicle door panel, the service hole cover including: a cover body part covering the service hole; and at least one catching part provided to protrude from the cover body part to a side of the inner panel, wherein the catching part is caught on the inner panel while at least a part of the service hole is opened.
 
  
 
===METHOD FOR MANUFACTURING FLUORINE-CONTAINING SILICA GLASS ([[US Patent Application 18246730. METHOD FOR MANUFACTURING FLUORINE-CONTAINING SILICA GLASS simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18246730]])===
 
===METHOD FOR MANUFACTURING FLUORINE-CONTAINING SILICA GLASS ([[US Patent Application 18246730. METHOD FOR MANUFACTURING FLUORINE-CONTAINING SILICA GLASS simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18246730]])===
Line 26: Line 44:
 
Tetsuya HARUNA
 
Tetsuya HARUNA
  
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−
'''Brief explanation'''
 
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The patent application describes a method for producing a fluorine-containing silica glass.
 
−
 
−
* The method involves degassing the inside of a furnace core tube under reduced pressure while heating it.
 
−
* A porous silica glass body is inserted into the furnace core tube in an airtight container.
 
−
* A fluorine compound gas is supplied into the furnace core tube under reduced pressure.
 
−
* The porous silica glass body is heat-treated under reduced pressure while the fluorine compound gas is supplied, and gas is discharged from the furnace core tube.
 
−
* The heat treatment is carried out at a temperature higher than the temperatures in the degassing and fluorine adding processes.
 
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* The end result is a transparent vitrified fluorine-containing silica glass.
 
−
 
−
'''Abstract'''
 
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A method for producing a fluorine-containing silica glass includes degassing which includes degassing an inside of a furnace core tube under reduced pressure while heating the inside of the furnace core tube, after inserting a porous silica glass body into the furnace core tube provided in an airtight container, supplying which includes degassing a fluorine compound gas into the furnace core tube under reduced pressure, fluorine adding which includes heat-treating the porous silica glass body under reduced pressure while supplying the fluorine compound gas into the furnace core tube and discharging a gas from the furnace core tube, and transparent vitrifying which includes heat-treating in a reduced pressure at a temperature higher than temperatures in the degassing process and the fluorine adding process.
 
  
 
===DIAMOND SINTERED MATERIAL AND TOOL INCLUDING DIAMOND SINTERED MATERIAL ([[US Patent Application 18032168. DIAMOND SINTERED MATERIAL AND TOOL INCLUDING DIAMOND SINTERED MATERIAL simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18032168]])===
 
===DIAMOND SINTERED MATERIAL AND TOOL INCLUDING DIAMOND SINTERED MATERIAL ([[US Patent Application 18032168. DIAMOND SINTERED MATERIAL AND TOOL INCLUDING DIAMOND SINTERED MATERIAL simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18032168]])===
Line 47: Line 52:
 
Hirotsugu IWASAKI
 
Hirotsugu IWASAKI
  
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−
'''Brief explanation'''
 
−
The abstract describes a diamond sintered material that consists of diamond grains. The content ratio of the diamond grains in the material is between 80% and 99% by volume. The average grain size of the diamond grains ranges from 0.1 μm to 50 μm. The dislocation density of the diamond grains falls between 8.1×10^6 and 1.0×10^7.
 
−
 
−
* Diamond sintered material with high diamond grain content (80-99% by volume)
 
−
* Diamond grains have an average size of 0.1 μm to 50 μm
 
−
* Diamond grains have a specific dislocation density range (8.1×10^6 to 1.0×10^7)
 
−
 
−
'''Abstract'''
 
−
A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 μm and less than or equal to 50 μm, and a dislocation density of the diamond grains is more than or equal to 8.1×10mand less than 1.0×10m.
 
  
 
===SYNTHETIC SINGLE CRYSTAL DIAMOND AND METHOD FOR PRODUCING SAME ([[US Patent Application 18034235. SYNTHETIC SINGLE CRYSTAL DIAMOND AND METHOD FOR PRODUCING SAME simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18034235]])===
 
===SYNTHETIC SINGLE CRYSTAL DIAMOND AND METHOD FOR PRODUCING SAME ([[US Patent Application 18034235. SYNTHETIC SINGLE CRYSTAL DIAMOND AND METHOD FOR PRODUCING SAME simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18034235]])===
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Hitoshi SUMIYA
 
Hitoshi SUMIYA
  
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−
'''Brief explanation'''
 
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The patent application describes a synthetic single crystal diamond that contains conjugants made up of one vacancy and one boron atom. The concentration of boron atoms in the diamond ranges from 0.1 ppm to 100 ppm.
 
−
 
−
* Synthetic single crystal diamond with specific boron atom composition
 
−
* Conjugants in the diamond consist of one vacancy and one boron atom
 
−
* Boron atom concentration ranges from 0.1 ppm to 100 ppm
 
−
 
−
'''Abstract'''
 
−
Provided is a synthetic single crystal diamond containing conjugants each composed of one vacancy and one boron atom, wherein the concentration of boron atoms based on atom numbers is 0.1 ppm or more and 100 ppm or less.
 
  
 
===LIGHT RECEIVING DEVICE AND LIGHT RECEIVING APPARATUS ([[US Patent Application 18124952. LIGHT RECEIVING DEVICE AND LIGHT RECEIVING APPARATUS simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18124952]])===
 
===LIGHT RECEIVING DEVICE AND LIGHT RECEIVING APPARATUS ([[US Patent Application 18124952. LIGHT RECEIVING DEVICE AND LIGHT RECEIVING APPARATUS simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18124952]])===
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Takuya OKIMOTO
 
Takuya OKIMOTO
  
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'''Brief explanation'''
 
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The patent application describes a light receiving device that includes a semiconductor substrate and a metal pattern layer.
 
−
* The device has a first major surface and a second major surface, with the metal pattern layer provided on the second major surface.
 
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* The first major surface has a first input port for signal light, a second input port for local oscillation light, a first light receiving element, an optical 90 degree hybrid element, and a second light receiving element.
 
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* The metal pattern layer contains either titanium or chromium.
 
−
 
−
Bullet points:
 
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* The device is designed to receive and process signal light and local oscillation light.
 
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* The first light receiving element is optically coupled to the first input port, allowing it to receive the signal light.
 
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* The optical 90 degree hybrid element is optically coupled to both the first input port and the second input port, allowing it to combine the signal light and local oscillation light.
 
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* The second light receiving element is optically coupled to the optical 90 degree hybrid element, allowing it to receive the combined light.
 
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* The metal pattern layer on the second major surface of the semiconductor substrate contains either titanium or chromium, which may have specific properties or functions in the device.
 
−
 
−
'''Abstract'''
 
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A light receiving device includes a semiconductor substrate having a first major surface and a second major surface opposite to the first major surface, and a metal pattern layer provided on the second major surface. The first major surface is provided with a first input port configured to receive an input of signal light, a second input port configured to receive an input of local oscillation light, a first light receiving element optically coupled to the first input port, an optical 90 degree hybrid element optically coupled to the first input port and the second input port, and a second light receiving element optically coupled to the optical 90 degree hybrid element. The metal pattern layer contains at least one of titanium or chromium.
 
  
 
===COUPLING MEMBER, CONNECTOR COUPLING SET, OPTICAL COUPLING STRUCTURE, AND COUPLING METHOD ([[US Patent Application 18201810. COUPLING MEMBER, CONNECTOR COUPLING SET, OPTICAL COUPLING STRUCTURE, AND COUPLING METHOD simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18201810]])===
 
===COUPLING MEMBER, CONNECTOR COUPLING SET, OPTICAL COUPLING STRUCTURE, AND COUPLING METHOD ([[US Patent Application 18201810. COUPLING MEMBER, CONNECTOR COUPLING SET, OPTICAL COUPLING STRUCTURE, AND COUPLING METHOD simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18201810]])===
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Taisuke NAGASAKI
 
Taisuke NAGASAKI
  
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'''Brief explanation'''
 
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The patent application describes a coupling member used to connect an optical component to a connector.
 
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* The coupling member has a locking portion that can be locked to the optical component.
 
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* An elastic portion is included to press the connector towards the optical component.
 
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* A connecting portion connects the locking portion to the elastic portion.
 
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* The elastic portion can move outward of the connector in a planar direction defined by the first and second directions.
 
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−
'''Abstract'''
 
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A coupling member for coupling an optical component to a connector in a first direction is disclosed. The coupling member includes a locking portion that extends in a second direction intersecting the first direction, the coupling member being configured to be locked to the optical component, an elastic portion configured to press the connector toward the optical component in the first direction, and a connecting portion that connects the locking portion to the elastic portion. The elastic portion is movable outward of the connector in a planar direction defined by the first direction and the second direction.
 
  
 
===OPTICAL RECEIVER ([[US Patent Application 18323447. OPTICAL RECEIVER simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18323447]])===
 
===OPTICAL RECEIVER ([[US Patent Application 18323447. OPTICAL RECEIVER simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18323447]])===
Line 125: Line 84:
 
Kazuaki MII
 
Kazuaki MII
  
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'''Brief explanation'''
 
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The patent application describes an optical receiver that includes a beam reducer and a light receiving element.
 
−
* The beam reducer consists of an incident lens that condenses incoming collimated light to a focal point.
 
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* An emitting lens then receives the light from the incident lens and emits collimated light with a smaller diameter.
 
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* The main body of the receiver is located between the incident lens and the emitting lens, with the focal point inside.
 
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* The light receiving element includes a light receiving lens that further condenses the emitted collimated light.
 
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* A light receiving portion within the light receiving element receives the condensed light for further processing.
 
−
 
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'''Abstract'''
 
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According to one embodiment, there is provided an optical receiver including: a beam reducer including an incident lens condensing first collimated light having a first diameter to a focal point, an emitting lens receiving light emitted from the incident lens and emitting second collimated light having a second diameter smaller than the first diameter, and a main body provided between the incident lens and the emitting lens, the main body having the focal point inside; and a light receiving element including a light receiving lens condensing the second collimated light and a light receiving portion receiving the light condensed by the light receiving lens.
 
  
 
===OPTICAL CONNECTOR MODULE, OPTICAL COUPLING STRUCTURE, CONNECTING MEMBER, AND CONNECTING METHOD ([[US Patent Application 18324483. OPTICAL CONNECTOR MODULE, OPTICAL COUPLING STRUCTURE, CONNECTING MEMBER, AND CONNECTING METHOD simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18324483]])===
 
===OPTICAL CONNECTOR MODULE, OPTICAL COUPLING STRUCTURE, CONNECTING MEMBER, AND CONNECTING METHOD ([[US Patent Application 18324483. OPTICAL CONNECTOR MODULE, OPTICAL COUPLING STRUCTURE, CONNECTING MEMBER, AND CONNECTING METHOD simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18324483]])===
Line 144: Line 92:
 
Taisuke NAGASAKI
 
Taisuke NAGASAKI
  
−
 
−
'''Brief explanation'''
 
−
The patent application describes an optical connector module that is connected to an optical component.
 
−
* The optical connector module includes at least one optical fiber and a connector that holds the optical fiber.
 
−
* The connector is designed to be connected to the optical component in a specific direction.
 
−
* A connecting member is included to maintain a connected state between the connector and the optical component.
 
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* The connecting member is able to rotate in contact with the connector and is engaged with both the connector and the optical component.
 
−
 
−
'''Abstract'''
 
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An optical connector module connected to an optical component is disclosed. The optical connector includes at least one optical fiber, a connector that holds the optical fiber, the connector being configured to be connected to the optical component in a first direction, and a connecting member configured to maintain a connected state between the connector and the optical component when the connector is connected to the optical component. The connecting member is configured to rotate in contact with the connector and to be engaged with each of the connector and the optical component.
 
  
 
===SHIELD CONNECTOR ([[US Patent Application 18031142. SHIELD CONNECTOR simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18031142]])===
 
===SHIELD CONNECTOR ([[US Patent Application 18031142. SHIELD CONNECTOR simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18031142]])===
Line 162: Line 100:
 
Hiroyoshi MAESOBA
 
Hiroyoshi MAESOBA
  
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−
'''Brief explanation'''
 
−
The patent application aims to improve the shielding performance of a shield connector.
 
−
* The shield connector includes a dielectric that accommodates an inner conductor and an outer conductor made of a metal plate material.
 
−
* The outer conductor consists of a box-shaped body portion and a receptacle projecting forward from a front wall portion of the body portion.
 
−
* A mating outer conductor can fit into the receptacle.
 
−
* The rear end part of the receptacle and the front wall portion are continually and electrically conductively connected.
 
−
* The innovation simplifies the design of the shield connector while maintaining its shielding performance.
 
−
 
−
'''Abstract'''
 
−
It is aimed to realize an improvement in shielding performance. A shield connector is provided with a dielectric for accommodating an inner conductor and an outer conductor made of a metal plate material and surrounding the dielectric. The outer conductor includes a box-shaped body portion and a receptacle projecting forward from a front wall portion of the body portion, a mating outer conductor being fit into the receptacle. A rear end part of the receptacle and the front wall portion are continually and electrically conductively connected.
 
  
 
===OPTICAL MODULE AND MANUFACTURING METHOD OF OPTICAL MODULE ([[US Patent Application 18321818. OPTICAL MODULE AND MANUFACTURING METHOD OF OPTICAL MODULE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18321818]])===
 
===OPTICAL MODULE AND MANUFACTURING METHOD OF OPTICAL MODULE ([[US Patent Application 18321818. OPTICAL MODULE AND MANUFACTURING METHOD OF OPTICAL MODULE simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)|18321818]])===
Line 180: Line 107:
  
 
Naoki ITABASHI
 
Naoki ITABASHI
−
 
−
 
−
'''Brief explanation'''
 
−
The patent application describes an optical module that includes an optical semiconductor element, a stem with a signal pin and a ground pin, and a circuit board.
 
−
* The circuit board has a signal through-hole and a ground through-hole, which are pierced by the signal pin and ground pin respectively.
 
−
* The signal line on the circuit board is electrically connected to the signal pin, and the ground layer is electrically connected to the ground pin.
 
−
* There is a junction part on the circuit board that connects the assistance through-hole and the ground layer around it with the stem.
 
−
* The distance between the assistance through-hole and the signal through-hole is smaller than the distance between the ground through-hole and the signal through-hole.
 
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−
'''Abstract'''
 
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An optical module includes an optical semiconductor element a stem including a signal pin and a ground pin; and a circuit board, the circuit board including a signal through-hole, a ground through-hole, a ground layer, and a junction part, the signal through-hole being configured to be pierced by the signal pin, the ground through-hole being configured to be pierced by the ground pin, the signal line being configured to be electrically connected with the signal pin, the ground layer being configured to be electrically connected with the ground pin, the junction part being configured to connect the assistance through-hole and the ground layer around the assistance through-hole with the stem. The circuit board has a first distance between the assistance through-hole and the signal through-hole, the first distance being smaller than a second distance between the ground through-hole and the signal through-hole.
 

Latest revision as of 14:54, 6 December 2023

Summary of the patent applications from SUMITOMO ELECTRIC INDUSTRIES, LTD. on November 30th, 2023

SUMITOMO ELECTRIC INDUSTRIES, LTD. has recently filed several patents related to various technologies. These patents cover areas such as optical modules, shield connectors, optical connector modules, optical receivers, coupling members, synthetic single crystal diamonds, diamond sintered materials, fluorine-containing silica glass, and service hole covers for vehicle door panels.

In the field of optical modules, one patent application describes an optical module that includes an optical semiconductor element, a stem with signal and ground pins, and a circuit board. The circuit board has signal and ground through-holes that are pierced by the respective pins, and the signal line on the board is electrically connected to the signal pin. The aim of this patent is to improve the shielding performance of the module.

Another patent application focuses on shield connectors, aiming to simplify their design while maintaining their shielding performance. The shield connector includes a dielectric, an inner conductor, and an outer conductor made of a metal plate material. The outer conductor consists of a box-shaped body portion and a receptacle, and a mating outer conductor can fit into the receptacle.

In the field of optical connector modules, a patent application describes a connector designed to be connected to an optical component in a specific direction. A connecting member is included to maintain the connected state between the connector and the optical component, and it can rotate in contact with the connector while being engaged with both the connector and the optical component.

In the area of optical receivers, a patent application describes a receiver that includes a beam reducer and a light receiving element. The beam reducer consists of an incident lens and an emitting lens, and the receiver's main body is located between them. The light receiving element includes a light receiving lens and a light receiving portion for further processing the received light.

Other patent applications cover topics such as coupling members used to connect optical components to connectors, synthetic single crystal diamonds with specific boron atom compositions, diamond sintered materials with high diamond grain content and specific dislocation densities, methods for producing fluorine-containing silica glass, and service hole covers for vehicle door panels.

Notable applications:

  • Optical module with improved shielding performance
  • Simplified design of shield connectors while maintaining shielding performance
  • Optical connector module with a connecting member for maintaining a connected state
  • Optical receiver with a beam reducer and a light receiving element
  • Coupling member for connecting optical components to connectors
  • Synthetic single crystal diamonds with specific boron atom compositions
  • Diamond sintered materials with high diamond grain content and specific dislocation densities
  • Method for producing fluorine-containing silica glass
  • Service hole cover for vehicle door panels.



Patent applications for SUMITOMO ELECTRIC INDUSTRIES, LTD. on November 30th, 2023

SERVICE HOLE COVER AND DOOR WIRING MODULE (18031531)

Main Inventor

Koji YAMAGUCHI


METHOD FOR MANUFACTURING FLUORINE-CONTAINING SILICA GLASS (18246730)

Main Inventor

Tetsuya HARUNA


DIAMOND SINTERED MATERIAL AND TOOL INCLUDING DIAMOND SINTERED MATERIAL (18032168)

Main Inventor

Hirotsugu IWASAKI


SYNTHETIC SINGLE CRYSTAL DIAMOND AND METHOD FOR PRODUCING SAME (18034235)

Main Inventor

Hitoshi SUMIYA


LIGHT RECEIVING DEVICE AND LIGHT RECEIVING APPARATUS (18124952)

Main Inventor

Takuya OKIMOTO


COUPLING MEMBER, CONNECTOR COUPLING SET, OPTICAL COUPLING STRUCTURE, AND COUPLING METHOD (18201810)

Main Inventor

Taisuke NAGASAKI


OPTICAL RECEIVER (18323447)

Main Inventor

Kazuaki MII


OPTICAL CONNECTOR MODULE, OPTICAL COUPLING STRUCTURE, CONNECTING MEMBER, AND CONNECTING METHOD (18324483)

Main Inventor

Taisuke NAGASAKI


SHIELD CONNECTOR (18031142)

Main Inventor

Hiroyoshi MAESOBA


OPTICAL MODULE AND MANUFACTURING METHOD OF OPTICAL MODULE (18321818)

Main Inventor

Naoki ITABASHI

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