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Show new changes starting from 20:04, 9 June 2024
   
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9 June 2024

N    17:39  SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024‎ diffhist +217,924‎ Wikipatents talk contribs Creating a new page
N    17:30  Samsung electronics co., ltd. (20240186369). INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME simplified abstract‎ diffhist +4,046‎ Wikipatents talk contribs Creating a new page
N    17:30  Samsung electronics co., ltd. (20240186367). INTEGRATION SCHEME FOR FABRICATING HIGH PRECISION, LOW CAPACITOR WITH UNLANDED VIA simplified abstract‎ diffhist +4,226‎ Wikipatents talk contribs Creating a new page
N    17:29  Samsung electronics co., ltd. (20240186290). SEMICONDUCTOR PACKAGE simplified abstract‎ diffhist +4,665‎ Wikipatents talk contribs Creating a new page
N    17:28  Samsung electronics co., ltd. (20240186231). SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE simplified abstract‎ diffhist +4,547‎ Wikipatents talk contribs Creating a new page

6 June 2024

N    05:55  18059398. SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF simplified abstract (NANYA TECHNOLOGY CORPORATION)‎ diffhist +3,953‎ Wikipatents talk contribs Creating a new page
N    05:40  18437549. MICROELECTRONIC DEVICES AND RELATED MEMORY DEVICES simplified abstract (Lodestar Licensing Group LLC)‎ diffhist +4,752‎ Wikipatents talk contribs Creating a new page
N    04:43  18221711. THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED WORD LINE CONTACT VIA STRUCTURES AND METHOD OF MAKING THE SAME simplified abstract (SanDisk Technologies LLC)‎ diffhist +3,273‎ Wikipatents talk contribs Creating a new page
N    04:42  18240560. STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEANDERING DIELECTRIC ISOLATION STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (SanDisk Technologies LLC)‎ diffhist +4,494‎ Wikipatents talk contribs Creating a new page
N    04:42  18351205. THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ENGINEERED CHARGE STORAGE ELEMENTS AND METHODS FOR FORMING THE SAME simplified abstract (SanDisk Technologies LLC)‎ diffhist +4,910‎ Wikipatents talk contribs Creating a new page
N    04:42  18221689. THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED WORD LINE CONTACT VIA STRUCTURES AND METHOD OF MAKING THE SAME simplified abstract (SanDisk Technologies LLC)‎ diffhist +4,290‎ Wikipatents talk contribs Creating a new page
N    04:42  18354269. STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THE SAME BY FORMING REPLACEMENT WORD LINES simplified abstract (SanDisk Technologies LLC)‎ diffhist +4,403‎ Wikipatents talk contribs Creating a new page
N    04:41  18349578. STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FORMING REPLACEMENT WORD LINES THROUGH MEMORY OPENINGS simplified abstract (SanDisk Technologies LLC)‎ diffhist +4,775‎ Wikipatents talk contribs Creating a new page
N    03:19  18437017. SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS simplified abstract (SONY GROUP CORPORATION)‎ diffhist +3,506‎ Wikipatents talk contribs Creating a new page
N    02:34  18432491. THREE-DIMENSIONAL SEMICONDUCTOR DEVICE HAVING A SUPPORT PATTERN IN CONTACT WITH A SIDE SURFACE OF A CONTACT PLUG simplified abstract (SK hynix Inc.)‎ diffhist +4,961‎ Wikipatents talk contribs Creating a new page
N    02:33  18432788. SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract (SK hynix Inc.)‎ diffhist +2,956‎ Wikipatents talk contribs Creating a new page
N    02:23  18432543. INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +4,119‎ Wikipatents talk contribs Creating a new page
N    02:23  18429926. LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +4,409‎ Wikipatents talk contribs Creating a new page
N    02:22  18434757. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +3,527‎ Wikipatents talk contribs Creating a new page
N    02:22  18434077. VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +4,377‎ Wikipatents talk contribs Creating a new page
N    02:22  18099952. SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +4,433‎ Wikipatents talk contribs Creating a new page
N    02:21  18435362. Integrated Circuit Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +4,612‎ Wikipatents talk contribs Creating a new page
N    02:11  18434347. LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract (Intel Corporation)‎ diffhist +4,504‎ Wikipatents talk contribs Creating a new page
N    02:10  18435609. DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)‎ diffhist +5,093‎ Wikipatents talk contribs Creating a new page
N    02:06  18060168. ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)‎ diffhist +3,134‎ Wikipatents talk contribs Creating a new page
N    01:21  18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)‎ diffhist +3,745‎ Wikipatents talk contribs Creating a new page
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