Related changes

Jump to navigation Jump to search

Enter a page name to see changes on pages linked to or from that page. (To see members of a category, enter Category:Name of category). Changes to pages on your Watchlist are in bold.

Recent changes options Show last 50 | 100 | 250 | 500 changes in last 1 | 3 | 7 | 14 | 30 days
Hide registered users | Hide anonymous users | Hide my edits | Show bots | Hide minor edits
Show new changes starting from 08:10, 9 June 2024
   
Page name:
List of abbreviations:
N
This edit created a new page (also see list of new pages)
m
This is a minor edit
b
This edit was performed by a bot
(±123)
The page size changed by this number of bytes

6 June 2024

N    05:55  18059398. SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF simplified abstract (NANYA TECHNOLOGY CORPORATION)‎ diffhist +3,953‎ Wikipatents talk contribs Creating a new page
N    05:40  18437549. MICROELECTRONIC DEVICES AND RELATED MEMORY DEVICES simplified abstract (Lodestar Licensing Group LLC)‎ diffhist +4,752‎ Wikipatents talk contribs Creating a new page
N    04:43  18221711. THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED WORD LINE CONTACT VIA STRUCTURES AND METHOD OF MAKING THE SAME simplified abstract (SanDisk Technologies LLC)‎ diffhist +3,273‎ Wikipatents talk contribs Creating a new page
N    04:42  18240560. STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEANDERING DIELECTRIC ISOLATION STRUCTURE AND METHODS OF FORMING THE SAME simplified abstract (SanDisk Technologies LLC)‎ diffhist +4,494‎ Wikipatents talk contribs Creating a new page
N    04:42  18351205. THREE-DIMENSIONAL MEMORY DEVICE CONTAINING ENGINEERED CHARGE STORAGE ELEMENTS AND METHODS FOR FORMING THE SAME simplified abstract (SanDisk Technologies LLC)‎ diffhist +4,910‎ Wikipatents talk contribs Creating a new page
N    04:42  18221689. THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED WORD LINE CONTACT VIA STRUCTURES AND METHOD OF MAKING THE SAME simplified abstract (SanDisk Technologies LLC)‎ diffhist +4,290‎ Wikipatents talk contribs Creating a new page
N    04:42  18354269. STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THE SAME BY FORMING REPLACEMENT WORD LINES simplified abstract (SanDisk Technologies LLC)‎ diffhist +4,403‎ Wikipatents talk contribs Creating a new page
N    04:41  18349578. STAIRLESS THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF BY FORMING REPLACEMENT WORD LINES THROUGH MEMORY OPENINGS simplified abstract (SanDisk Technologies LLC)‎ diffhist +4,775‎ Wikipatents talk contribs Creating a new page
N    03:19  18437017. SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS simplified abstract (SONY GROUP CORPORATION)‎ diffhist +3,506‎ Wikipatents talk contribs Creating a new page
N    02:34  18432491. THREE-DIMENSIONAL SEMICONDUCTOR DEVICE HAVING A SUPPORT PATTERN IN CONTACT WITH A SIDE SURFACE OF A CONTACT PLUG simplified abstract (SK hynix Inc.)‎ diffhist +4,961‎ Wikipatents talk contribs Creating a new page
N    02:33  18432788. SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract (SK hynix Inc.)‎ diffhist +2,956‎ Wikipatents talk contribs Creating a new page
N    02:23  18432543. INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +4,119‎ Wikipatents talk contribs Creating a new page
N    02:23  18429926. LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +4,409‎ Wikipatents talk contribs Creating a new page
N    02:22  18434757. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +3,527‎ Wikipatents talk contribs Creating a new page
N    02:22  18434077. VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +4,377‎ Wikipatents talk contribs Creating a new page
N    02:22  18099952. SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +4,433‎ Wikipatents talk contribs Creating a new page
N    02:21  18435362. Integrated Circuit Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)‎ diffhist +4,612‎ Wikipatents talk contribs Creating a new page
N    02:11  18434347. LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract (Intel Corporation)‎ diffhist +4,504‎ Wikipatents talk contribs Creating a new page
N    02:10  18435609. DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)‎ diffhist +5,093‎ Wikipatents talk contribs Creating a new page
N    02:06  18060168. ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)‎ diffhist +3,134‎ Wikipatents talk contribs Creating a new page
N    01:21  18430982. Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)‎ diffhist +3,745‎ Wikipatents talk contribs Creating a new page

31 May 2024

N    08:44  18382546. SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +4,378‎ Wikipatents talk contribs Creating a new page
N    08:43  18339569. INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)‎ diffhist +4,562‎ Wikipatents talk contribs Creating a new page
N    08:20  SK hynix Inc. patent applications on May 30th, 2024‎ diffhist +39,433‎ Wikipatents talk contribs Creating a new page
N    08:19  Sk hynix inc. (20240179918). THREE-DIMENSIONAL SEMICONDUCTOR DEVICE HAVING A SUPPORT PATTERN IN CONTACT WITH A SIDE SURFACE OF A CONTACT PLUG simplified abstract‎ diffhist +4,648‎ Wikipatents talk contribs Creating a new page
N    08:19  Sk hynix inc. (20240178172). SEMICONDUCTOR DEVICE INCLUDING RESISTOR ELEMENT simplified abstract‎ diffhist +2,861‎ Wikipatents talk contribs Creating a new page
N    08:10  Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 30th, 2024‎ diffhist +71,991‎ Wikipatents talk contribs Creating a new page
N    08:07  Taiwan semiconductor manufacturing company, ltd. (20240178215). INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF simplified abstract‎ diffhist +3,687‎ Wikipatents talk contribs Creating a new page
N    08:07  Taiwan semiconductor manufacturing company, ltd. (20240178214). LAYOUT DESIGNS OF INTEGRATED CIRCUITS HAVING BACKSIDE ROUTING TRACKS simplified abstract‎ diffhist +4,895‎ Wikipatents talk contribs Creating a new page
N    08:07  Taiwan semiconductor manufacturing company, ltd. (20240178133). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract‎ diffhist +4,016‎ Wikipatents talk contribs Creating a new page
N    08:06  Taiwan semiconductor manufacturing company, ltd. (20240178132). VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE simplified abstract‎ diffhist +4,349‎ Wikipatents talk contribs Creating a new page
N    08:06  Taiwan semiconductor manufacturing company, ltd. (20240178128). SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND METHODS OF FORMING THE SAME simplified abstract‎ diffhist +4,243‎ Wikipatents talk contribs Creating a new page
N    08:06  Taiwan semiconductor manufacturing company, ltd. (20240178091). Integrated Circuit Package and Method simplified abstract‎ diffhist +4,283‎ Wikipatents talk contribs Creating a new page
N    07:57  Intel Corporation patent applications on May 30th, 2024‎ diffhist +62,684‎ Wikipatents talk contribs Creating a new page
N    07:54  Intel corporation (20240178145). LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract‎ diffhist +4,642‎ Wikipatents talk contribs Creating a new page
N    07:54  Intel corporation (20240178071). DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract‎ diffhist +4,871‎ Wikipatents talk contribs Creating a new page
N    07:51  INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 30th, 2024‎ diffhist +74,925‎ Wikipatents talk contribs Creating a new page
N    07:48  International business machines corporation (20240178127). ISOLATED SUPER VIA TO MIDDLE METAL LINE LEVEL simplified abstract‎ diffhist +3,888‎ Wikipatents talk contribs Creating a new page
N    07:17  HUAWEI TECHNOLOGIES CO., LTD. patent applications on May 30th, 2024‎ diffhist +85,838‎ Wikipatents talk contribs Creating a new page
N    07:11  Huawei technologies co., ltd. (20240178103). Chip Stacked Structure and Manufacturing Method Thereof, Chip Package Structure, and Electronic Device simplified abstract‎ diffhist +3,783‎ Wikipatents talk contribs Creating a new page
N    06:32  Samsung Electronics Co., Ltd. patent applications on May 30th, 2024‎ diffhist +232,227‎ Wikipatents talk contribs Creating a new page
N    06:21  Samsung electronics co., ltd. (20240178131). SEMICONDUCTOR DEVICE HAVING THROUGH-VIA STRUCTURE simplified abstract‎ diffhist +4,149‎ Wikipatents talk contribs Creating a new page
N    06:21  Samsung electronics co., ltd. (20240178061). INTEGRATED CIRCUIT DEVICE simplified abstract‎ diffhist +4,331‎ Wikipatents talk contribs Creating a new page
N    06:11  Blockchain patent applications on May 30th, 2024‎ diffhist +266,110‎ Wikipatents talk contribs Creating a new page

24 May 2024

N    08:13  18318480. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE simplified abstract (SK hynix Inc.)‎ diffhist +3,949‎ Wikipatents talk contribs Creating a new page
N    08:09  18315432. SEMICONDUCTOR DEVICE HAVING DEFECT DETECTION CIRCUIT simplified abstract (SK hynix Inc.)‎ diffhist +3,496‎ Wikipatents talk contribs Creating a new page
N    07:32  18416508. TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)‎ diffhist +5,330‎ Wikipatents talk contribs Creating a new page
N    07:31  18419015. SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STACKED DEVICES simplified abstract (Intel Corporation)‎ diffhist +4,766‎ Wikipatents talk contribs Creating a new page
N    07:24  17781013. METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)‎ diffhist +3,657‎ Wikipatents talk contribs Creating a new page
N    07:11  18156847. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)‎ diffhist +3,719‎ Wikipatents talk contribs Creating a new page
Retrieved from "http://wikipatents.org/index.php?title=Special:RecentChangesLinked"