Information for "18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation)"
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| Display title | 18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation) |
| Default sort key | 18395351. IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS simplified abstract (Intel Corporation) |
| Page length (in bytes) | 4,597 |
| Page ID | 50451 |
| Page content language | en - English |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 0 |
| Counted as a content page | Yes |
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| Edit | Allow all users (infinite) |
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Edit history
| Page creator | Wikipatents (talk | contribs) |
| Date of page creation | 06:35, 26 April 2024 |
| Latest editor | Wikipatents (talk | contribs) |
| Date of latest edit | 06:35, 26 April 2024 |
| Total number of edits | 1 |
| Total number of distinct authors | 1 |
| Recent number of edits (within past 90 days) | 1 |
| Recent number of distinct authors | 1 |
