View source for US Patent Application 18447211. SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION simplified abstract

=SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]

==Inventor(s)==

[[:Category:Chun-Wei Hsu of Hsinchu (TW)|Chun-Wei Hsu of Hsinchu (TW)]][[Category:Chun-Wei Hsu of Hsinchu (TW)]]

==SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18447211 titled 'SYSTEM AND METHOD FOR REMOVING DEBRIS DURING CHEMICAL MECHANICAL PLANARIZATION

==Simplified Explanation==

- The patent application describes a chemical mechanical planarization system.
- The system includes a rotating chemical mechanical planarization pad.
- A chemical mechanical planarization head places a semiconductor wafer in contact with the pad.
- A slurry supply system supplies a slurry onto the pad during the process.
- A pad conditioner is used to condition the pad during the process.
- A suction system removes debris from the pad, including the pad conditioner and slurry.


==Original Abstract Submitted==

A chemical mechanical planarization system includes a chemical mechanical planarization pad that rotates during a chemical mechanical planarization process. A chemical mechanical planarization head places a semiconductor wafer in contact with the chemical mechanical planarization pad during the process. A slurry supply system supplies a slurry onto the pad during the process. A pad conditioner conditions the pad during the process. A suction system removes pad conditioner debris and the slurry from the pad.



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