View source for US Patent Application 18355868. CONTAINER INCLUDING RFID MODULE simplified abstract

=CONTAINER INCLUDING RFID MODULE=


==Organization Name==

[[Murata Manufacturing Co., Ltd.]]


==Inventor(s)==

[[Noboru Kato of Nagaokakyo-shi (JP)]]

==CONTAINER INCLUDING RFID MODULE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18355868 titled 'CONTAINER INCLUDING RFID MODULE

==Simplified Explanation==

The patent application describes a container with insulating properties and a metal film on its surface.
* The container has a first slit in the metal film, separating it into two regions.
* An RFID module is included in the container, consisting of an RFIC element, a filter circuit, and two electrodes.
* The first electrode is connected to the first metal region, and the second electrode is connected to the second metal region.
* The first metal region is continuous with the metal film on the first surface of the container.
* The second metal region is capacitively coupled to the metal film on the second surface of the container.


==Original Abstract Submitted==

A container is provided includes a base material having insulating properties that form an outer shape, a metal film on the base material, and a first slit in the metal film. The base material includes a first surface, a second surface, and a first flap continuous with the first surface. The first slit separates the metal film on the first flap into first and second metal regions. An RFID module includes an RFIC element, a filter circuit, and first and second electrodes connected to the filter circuit. The first electrode and the first metal region are electrically connected to each other. The second electrode and the second metal region are electrically connected to each other. The first metal region is continuous with the metal film on the first surface and the second metal region is capacitively coupled to the metal film on the second surface.