View source for US Patent Application 18221787. SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT simplified abstract

=SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT=


==Organization Name==

[[Taiwan Semiconductor Manufacturing Company, Ltd.]]


==Inventor(s)==

[[Gerben Doornbos of Kessel-Lo (BE)]]

[[Marcus Johannes Henricus Van Dal of Linden (BE)]]

==SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18221787 titled 'SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT

==Simplified Explanation==

The patent application describes a semiconductor device that includes a main circuit and a backside power delivery circuit.
* The main circuit is located on the front surface of the substrate.
* The backside power delivery circuit is located on the back surface of the substrate.
* The backside power delivery circuit includes various power supply wirings and a switch.
* The power supply wirings are embedded in a backside insulating layer on the substrate.
* The backside power delivery circuit is connected to the main circuit through a through-silicon via (TSV) passing through the substrate.
* The TSV allows the backside power delivery circuit to supply power to the main circuit.


==Original Abstract Submitted==

A semiconductor device includes a substrate, a main circuit disposed over a front surface of the substrate, and a backside power delivery circuit disposed over a back surface of the substrate. The backside power delivery circuit includes a first main power supply wiring for supplying a first voltage, a second main power supply wiring for supplying a second voltage, a first local power supply wiring, and a first switch coupled to the first main power supply wiring and the first local power supply wiring. The first main power supply wiring, the second main power supply wiring and the first local power supply wiring are embedded in a first back side insulating layer disposed over the back surface of the substrate. The first local power supply wiring is coupled to the main circuit via a first through-silicon via (TSV) passing through the substrate for supplying the first voltage.