View source for US Patent Application 18059594. SUBSTRATE PROCESSING APPARATUS AND A METHOD OF PROCESSING A SUBSTRATE USING THE SAME simplified abstract

=SUBSTRATE PROCESSING APPARATUS AND A METHOD OF PROCESSING A SUBSTRATE USING THE SAME=


==Organization Name==

[[Samsung Electronics Co., Ltd.]]


==Inventor(s)==

[[JUNGHYUN Song of Suwon-si (KR)]]

[[ANSOOK Sul of Suwon-si (KR)]]

[[JEONGHUN Kang of Suwon-si (KR)]]

[[DONOK Choi of Suwon-si (KR)]]

[[SUNG YONG Park of Suwon-si (KR)]]

==SUBSTRATE PROCESSING APPARATUS AND A METHOD OF PROCESSING A SUBSTRATE USING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18059594 titled 'SUBSTRATE PROCESSING APPARATUS AND A METHOD OF PROCESSING A SUBSTRATE USING THE SAME

==Simplified Explanation==

The patent application describes a substrate processing apparatus with an outer bath and an inner bath within it. 
* The apparatus includes a chemical solution supply pipe and an outer gas supply pipe for supplying chemicals and gas to the outer bath. 
* The outer bath has an outer body and an outer door to close the outer receiving space. 
* The outer gas supply pipe is located between the outer body and the inner bath, while a portion of the chemical solution supply pipe is located in the inner bath.


==Original Abstract Submitted==

A substrate processing apparatus includes an outer bath, an inner bath in the outer bath, a chemical solution supply pipe in fluid communication with a portion of the outer bath, and an outer gas supply pipe in fluid communication with another portion of the outer bath. The outer bath includes an outer body providing an outer receiving space, and an outer door coupled to the outer body and configured to close the outer receiving space. An end of the outer gas supply pipe is located in the outer receiving space between the outer body and the inner bath, and a portion of the chemical solution supply pipe is located in the inner bath.