View source for US Patent Application 17885237. VIA STRUCTURE CONNECTING FRONT SIDE STRUCTURE OF SEMICONDUCTOR DEVICE TO BSPDN, AND METHOD OF MANUFACTURING THE SAME USING SACRIFICIAL VIA STRUCTURE simplified abstract

=VIA STRUCTURE CONNECTING FRONT SIDE STRUCTURE OF SEMICONDUCTOR DEVICE TO BSPDN, AND METHOD OF MANUFACTURING THE SAME USING SACRIFICIAL VIA STRUCTURE=


==Organization Name==

[[Samsung Electronics Co., Ltd.]]


==Inventor(s)==

[[Eun Sung Kim of Clifton Park NY (US)]]


[[Jaejik Baek of Watervliet NY (US)]]


[[Wonhyuk Hong of Clifton Park NY (US)]]


[[Myunghoon Jung of Clifton Park NY (US)]]


[[Jongjin Lee of Seoul (KR)]]


[[Kang-ill Seo of Albany NY (US)]]


==VIA STRUCTURE CONNECTING FRONT SIDE STRUCTURE OF SEMICONDUCTOR DEVICE TO BSPDN, AND METHOD OF MANUFACTURING THE SAME USING SACRIFICIAL VIA STRUCTURE - A simplified explanation of the abstract==


*This abstract for appeared for US patent application  number 17885237 Titled 'VIA STRUCTURE CONNECTING FRONT SIDE STRUCTURE OF SEMICONDUCTOR DEVICE TO BSPDN, AND METHOD OF MANUFACTURING THE SAME USING SACRIFICIAL VIA STRUCTURE'

==Simplified Explanation==

The abstract describes a semiconductor device that consists of a transistor, a front side structure, and a back side structure. These structures are positioned opposite each other in relation to the transistor. The device also includes a front via, which is a connection between the front side structure and the back side structure. The front via is formed by a via hole, which is made up of a lower via hole and an upper via hole that are vertically connected. The via hole has a bent structure on the side where the lower and upper via holes meet.


==Original Abstract Submitted==

Provided is a semiconductor device that includes: at least one transistor, a front side structure, and a back side structure, the front side structure being disposed opposite to the back side structure with respect to the transistor; and a front via formed at a side of the transistor and connecting the front side structure to the back side structure, wherein the front via is formed in a via hole formed of a lower via hole and an upper via hole vertically connected to each other, and wherein the via hole has a bent structure at a side surface thereof where the lower via hole is connected to the upper via hole.