View source for US Patent Application 17809901. PROBE CARD DEVICE AND CIRCUIT PROTECTION ASSEMBLY THEREOF simplified abstract

=PROBE CARD DEVICE AND CIRCUIT PROTECTION ASSEMBLY THEREOF=


==Organization Name==

[[Taiwan Semiconductor Manufacturing Company, Ltd.]]


==Inventor(s)==

[[Chih-Chieh Liao of HSINCHU CITY (TW)]]

[[Yu-Min Sun of HSINCHU CITY (TW)]]

[[Chih-Feng Cheng of HSINCHU CITY (TW)]]

==PROBE CARD DEVICE AND CIRCUIT PROTECTION ASSEMBLY THEREOF - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17809901 titled 'PROBE CARD DEVICE AND CIRCUIT PROTECTION ASSEMBLY THEREOF

==Simplified Explanation==

The patent application describes a probe card device that includes a wiring board, a probe head, and a circuit protection assembly.
* The wiring board has multiple contacts.
* The probe head has a probe holder and multiple conductive probes arranged on it.
* The circuit protection assembly includes an insulation plate, through holes, and self-resetting fusing elements.
* The insulation plate is placed between the wiring board and the probe head.
* The through holes are formed on the insulation plate in an array form.
* The self-resetting fusing elements are placed within the through holes.
* Each self-resetting fusing element is connected to a contact and a conductive probe.
* The purpose of the self-resetting fusing elements is to break down electric currents from the wiring board to the conductive probe.
* The self-resetting fusing elements can reverse the breakdown and restore the electric current flow.


==Original Abstract Submitted==

A probe card device includes a wiring board provided with a plurality of contacts, a probe head having a probe holder and a plurality of conductive probes arranged on the probe holder, respectively, and a circuit protection assembly including an insulation plate, a plurality of through holes and a plurality of self-resetting fusing elements. The insulation plate is sandwiched between the wiring board and the probe head. The through holes are respectively formed on the insulation plate and arranged in an array form. The self-resetting fusing elements are respectively disposed within the through holes. Each of the self-resetting fusing elements is electrically connected to one of the contacts and one of the conductive probes for reversibly breaking down electric currents from the wiring board to the conductive probe.