View source for US Patent Application 17737670. CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER simplified abstract

=CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER=


==Organization Name==

[[Applied Materials, Inc.]]


==Inventor(s)==

[[David Coumou of Webster NY (US)]]

[[Zhi Wang of Sunnyvale CA (US)]]

[[Tao Zhang of San Ramon CA (US)]]

[[David Peterson of San Jose CA (US)]]

==CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17737670 titled 'CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER

==Simplified Explanation==

The abstract describes a process power controller for a plasma processing tool. 

* The process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller.
* The source predictor is connected to both the process power source optimizer and the process uniformity controller.
* The process power controller is designed to optimize the power source for the plasma processing tool.
* The source predictor helps in predicting the power requirements for the process.
* The process uniformity controller ensures that the process is carried out uniformly.
* The process power controller improves the efficiency and effectiveness of the plasma processing tool.


==Original Abstract Submitted==

Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.