View source for Texas instruments incorporated (20240109247). ADDITIVE PROCESS FOR CIRCULAR PRINTING simplified abstract

=ADDITIVE PROCESS FOR CIRCULAR PRINTING=


==Organization Name==

[[:Category:texas instruments incorporated|texas instruments incorporated]]


[[Category:texas instruments incorporated]]

==Inventor(s)==

[[:Category:Daniel Lee Revier of Seattle WA (US)|Daniel Lee Revier of Seattle WA (US)]][[Category:Daniel Lee Revier of Seattle WA (US)]]

[[:Category:Sean Ping Chang of Richardson TX (US)|Sean Ping Chang of Richardson TX (US)]][[Category:Sean Ping Chang of Richardson TX (US)]]

[[:Category:Benjamin Stassen Cook of Los Gatos CA (US)|Benjamin Stassen Cook of Los Gatos CA (US)]][[Category:Benjamin Stassen Cook of Los Gatos CA (US)]]

==ADDITIVE PROCESS FOR CIRCULAR PRINTING - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240109247 titled 'ADDITIVE PROCESS FOR CIRCULAR PRINTING

==Simplified Explanation==

In a circular printing process, a layer of additive material is formed on a substrate using additive sources distributed across a printing zone. The substrate and additive sources rotate around a center of rotation to create a pattern of additive material in a circular printing area.

* Additive sources form discrete amounts of additive material on the substrate.
* Each additive source receives actuation waveforms at a frequency proportional to its distance from the center of rotation.
* Actuation waveforms include formation signals that dictate the amount of additive material to be deposited.
* The additive sources rotate with the substrate to create a precise pattern of additive material.

== Potential Applications ==
This technology could be used in 3D printing, electronics manufacturing, and microfabrication processes.

== Problems Solved ==
This innovation solves the problem of accurately depositing additive material in a circular pattern on a substrate.

== Benefits ==
The benefits of this technology include precise control over additive material deposition, increased efficiency in printing processes, and the ability to create complex patterns with high accuracy.

== Potential Commercial Applications ==
One potential commercial application of this technology could be in the production of microelectronics components.

== Possible Prior Art ==
One possible prior art for this technology could be similar additive manufacturing processes that use rotating substrates for material deposition.

=== Unanswered Questions ===

=== How does this technology compare to traditional additive manufacturing processes? ===
This technology offers more precise control over material deposition compared to traditional methods, but how does it affect production speed and cost?

=== What are the limitations of this technology in terms of substrate size and material compatibility? ===
It is important to understand the constraints of this technology in terms of substrate dimensions and the types of materials that can be used for additive material deposition.


==Original Abstract Submitted==

a layer of additive material is formed in a circular printing area on a substrate using additive sources distributed across a printing zone. the additive sources form predetermined discrete amounts of the additive material. the substrate and the additive sources are rotated with respect to each other around a center of rotation, so that a pattern of the additive material is formed in a circular printing area on the substrate. each additive source receives actuation waveforms at an actuation frequency that is proportional to a distance of the additive source from the center of rotation. the actuation waveforms include formation signals, with a maximum of one formation signal in each cycle of the actuation frequency. the formation signals result in the additive sources forming the predetermined discrete amounts of the additive material on the substrate.



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