View source for Samsung electronics co., ltd. (20240091902). RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD simplified abstract

=RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD=


==Organization Name==

[[:Category:samsung electronics co., ltd.|samsung electronics co., ltd.]]


[[Category:samsung electronics co., ltd.]]

==Inventor(s)==

[[:Category:Sangyun Lee of Suwon-si (KR)|Sangyun Lee of Suwon-si (KR)]][[Category:Sangyun Lee of Suwon-si (KR)]]

[[:Category:Younghun Kim of Suwon-si (KR)|Younghun Kim of Suwon-si (KR)]][[Category:Younghun Kim of Suwon-si (KR)]]

==RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240091902 titled 'RETAINER RING, CHEMICAL MECHANICAL POLISHING APPARATUS, AND SUBSTRATE POLISHING METHOD

==Simplified Explanation==

The patent application describes a retainer ring for a chemical mechanical polishing apparatus, with a slurry groove that is recessed from the bottom surface of the ring and extends in an arc shape from the inner surface towards the outer surface. The curvature radius of the groove is greater than the distance between the center of the ring and the curvature center of the groove.

* The retainer ring has a slurry groove that is upwardly recessed from the bottom surface.
* The slurry groove extends in an arc shape from the inner surface towards the outer surface of the retainer ring.
* The curvature radius of the slurry groove is greater than the distance between the center of the retainer ring and the curvature center of the groove.

== Potential Applications ==
This technology could be applied in the semiconductor industry for polishing substrates to achieve precise flatness and surface quality.

== Problems Solved ==
This innovation helps in improving the polishing process by providing a more efficient slurry distribution and reducing the risk of uneven polishing.

== Benefits ==
- Enhanced polishing performance
- Improved substrate flatness and surface quality
- Reduced risk of defects during polishing

== Potential Commercial Applications ==
"Enhancing Substrate Polishing Efficiency with Innovative Retainer Ring Design"

== Possible Prior Art ==
There may be prior art related to retainer rings for chemical mechanical polishing apparatuses, but specific details are not provided in the abstract.

== Unanswered Questions ==

=== How does the curvature radius of the slurry groove impact the polishing process? ===
The curvature radius affects the distribution of slurry and the uniformity of polishing, but the specific relationship is not detailed in the abstract.

=== Are there any specific materials recommended for manufacturing this retainer ring? ===
The abstract does not mention any specific materials used for the retainer ring, leaving this aspect open for further exploration.


==Original Abstract Submitted==

provided is a retainer ring, a chemical mechanical polishing apparatuses including the same, and a substrate polishing method using the same. a slurry groove is upwardly recessed from a bottom surface of the retainer ring. the slurry groove extends in an arc shape from an inner surface of the retainer ring toward an outer surface of the retainer ring. a curvature radius of the slurry groove is greater than a distance between a center of the retainer ring and a curvature center of the slurry groove.



[[Category:B24B37/32]]
[[Category:B24B57/02]]