View source for Meta platforms technologies, llc (20240098348). CAMERA MODULE ON FLEXIBLE INTERCONNECT TAPE simplified abstract

=CAMERA MODULE ON FLEXIBLE INTERCONNECT TAPE=


==Organization Name==

[[:Category:meta platforms technologies, llc|meta platforms technologies, llc]]


[[Category:meta platforms technologies, llc]]

==Inventor(s)==

[[:Category:Samuel Tam of Daly City CA (US)|Samuel Tam of Daly City CA (US)]][[Category:Samuel Tam of Daly City CA (US)]]

==CAMERA MODULE ON FLEXIBLE INTERCONNECT TAPE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240098348 titled 'CAMERA MODULE ON FLEXIBLE INTERCONNECT TAPE

==Simplified Explanation==

The camera module described in the patent application includes an image sensor die, high-density interconnect (HDI) tape, and passive electronic components. The image sensor die has a pixel array on one side and bonding pads on the other side. The HDI tape is a flexible substrate with traces that connect the image sensor die to the passive electronic components, providing rigidity to the camera module.

* Image sensor die with pixel array and bonding pads
* HDI tape with traces connecting image sensor die to passive electronic components
* Passive electronic components providing rigidity to the camera module

== Potential Applications ==
The technology described in this patent application could be used in various camera modules for electronic devices such as smartphones, tablets, laptops, and digital cameras.

== Problems Solved ==
This technology solves the problem of connecting the image sensor die to passive electronic components in a compact and rigid manner, ensuring the stability and functionality of the camera module.

== Benefits ==
The benefits of this technology include improved structural integrity, efficient signal transmission, and enhanced overall performance of the camera module.

== Potential Commercial Applications ==
The potential commercial applications of this technology include smartphone cameras, tablet cameras, laptop webcams, and digital cameras for consumer electronics manufacturers.

== Possible Prior Art ==
One possible prior art for this technology could be the use of flexible substrates and passive electronic components in camera modules for electronic devices.

=== Unanswered Questions ===

== What materials are used in the construction of the HDI tape? ==
The patent application does not specify the exact materials used in the construction of the HDI tape. Further details on the composition of the HDI tape could provide insights into the performance and durability of the camera module.

== How are the passive electronic components selected and integrated into the camera module? ==
The patent application mentions the presence of passive electronic components providing rigidity to the camera module, but it does not elaborate on the selection criteria or integration process of these components. Understanding the specific passive electronic components used and their placement within the camera module could shed light on the design considerations and functionality of the technology.


==Original Abstract Submitted==

a camera module includes an image sensor die, high-density interconnect (hdi) tape, and a number of passive electronic components. the image sensor die has a first side and a second side. the first side includes a pixel array, and the second side includes a number of bonding pads. the hdi tape is a flexible substrate coupled to the image sensor. the hdi tape includes a number of traces positioned between a first side and a second side. the first side of the hdi tape is coupled to the second side of the image sensor die. the passive electronic components are coupled to the second side of the hdi tape and provide rigidity to the camera module.



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