View source for Delphi technologies ip limited (20240105552). SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS simplified abstract

=SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS=


==Organization Name==

[[:Category:delphi technologies ip limited|delphi technologies ip limited]]


[[Category:delphi technologies ip limited]]

==Inventor(s)==

[[:Category:Kevin M. Gertiser of Carmel IN (US)|Kevin M. Gertiser of Carmel IN (US)]][[Category:Kevin M. Gertiser of Carmel IN (US)]]

[[:Category:Chris Fruth of Kokomo IN (US)|Chris Fruth of Kokomo IN (US)]][[Category:Chris Fruth of Kokomo IN (US)]]

==SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240105552 titled 'SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS

==Simplified Explanation==

The abstract describes a power module with a fin system that is in thermal connection with a power switch and is disposed within a fluid passage.

* The power module includes a fin housing with a fluid passage.
* The power switch has an exterior surface.
* The fin system consists of multiple fins attached to a base plate, extending away from the power switch's exterior surface.
* The fin system is in thermal connection with the power switch and is located within the fluid passage.

== Potential Applications ==
This technology could be applied in various cooling systems for power electronics, such as inverters, converters, and motor drives.

== Problems Solved ==
1. Efficient cooling of power switches to prevent overheating.
2. Enhanced thermal management within power modules.

== Benefits ==
1. Improved reliability and longevity of power electronics.
2. Increased efficiency through better heat dissipation.
3. Compact design for space-saving in electronic devices.

== Potential Commercial Applications ==
Optimizing thermal management in electric vehicles, renewable energy systems, and industrial automation equipment.

== Possible Prior Art ==
Prior art may include similar cooling systems for power modules in electronic devices, such as heat sinks and liquid cooling solutions.

== Unanswered Questions ==

=== How does the fin system impact the overall size of the power module? ===
The article does not provide information on whether the addition of the fin system increases the size of the power module or if it can be integrated without significant changes in dimensions.

=== What materials are used in the construction of the fin system? ===
The article does not specify the materials used for the fins, base plate, or other components of the fin system, which could impact the performance and cost of the power module.


==Original Abstract Submitted==

a power module includes: a fin housing including a fluid passage; a power switch having an exterior surface; and a fin system comprising a plurality of fins attached to a base plate, the plurality of fins extending from the base plate and away from the exterior surface of the power switch, the fin system being in thermal connection with the exterior surface of the power switch and disposed within the fluid passage.



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