View source for Advanced micro devices, inc. (20240113004). CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFACE USING A SPACER INTERCONNECT COUPLED TO A PORTION OF THE CHIPLET simplified abstract

=CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFACE USING A SPACER INTERCONNECT COUPLED TO A PORTION OF THE CHIPLET=


==Organization Name==

[[:Category:advanced micro devices, inc.|advanced micro devices, inc.]]


[[Category:advanced micro devices, inc.]]

==Inventor(s)==

[[:Category:GABRIEL H. Loh of BELLEVUE WA (US)|GABRIEL H. Loh of BELLEVUE WA (US)]][[Category:GABRIEL H. Loh of BELLEVUE WA (US)]]

[[:Category:ERIC J. Chapman of AUSTIN TX (US)|ERIC J. Chapman of AUSTIN TX (US)]][[Category:ERIC J. Chapman of AUSTIN TX (US)]]

[[:Category:RAJA Swaminathan of AUSTIN TX (US)|RAJA Swaminathan of AUSTIN TX (US)]][[Category:RAJA Swaminathan of AUSTIN TX (US)]]

==CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFACE USING A SPACER INTERCONNECT COUPLED TO A PORTION OF THE CHIPLET - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240113004 titled 'CONNECTING A CHIPLET TO AN INTERPOSER DIE AND TO A PACKAGE INTERFACE USING A SPACER INTERCONNECT COUPLED TO A PORTION OF THE CHIPLET

==Simplified Explanation==

The semiconductor package assembly described in the abstract involves an interposer die with conductive connections, a package interface, and a chiplet with a connectivity region.

* Interposer die with conductive connections:
    - The interposer die has a first surface and a second surface with conductive connections between them.
    - The first surface of the interposer die is positioned on the package interface.

* Chiplet with connectivity region:
    - The chiplet includes a connectivity region with conductive pathways.
    - A portion of the connectivity region is coupled to a conductive connection of the interposer die.
    - Another portion of the connectivity region is cantilevered from the interposer die.

== Potential Applications ==
The technology described in this patent application could be applied in:
- Advanced semiconductor packaging
- High-performance computing systems
- Data centers

== Problems Solved ==
This technology helps in:
- Improving connectivity between different components in a semiconductor package
- Enhancing signal transmission efficiency
- Reducing signal interference

== Benefits ==
The benefits of this technology include:
- Increased performance of semiconductor devices
- Higher data transfer speeds
- Improved reliability and durability of electronic systems

== Potential Commercial Applications ==
The potential commercial applications of this technology could be in:
- Semiconductor manufacturing industry
- Electronics and telecommunications sector
- Aerospace and defense technology

== Possible Prior Art ==
One possible prior art for this technology could be the use of interposer dies in semiconductor packaging to improve signal transmission and connectivity. 

=== Unanswered Questions ===

=== How does this technology impact the overall cost of semiconductor package assembly? ===

The abstract does not provide information on the cost implications of implementing this technology. It would be important to understand if the use of interposer dies and chiplets affects the overall cost of semiconductor package assembly and if there are any cost-saving benefits associated with this technology.

=== What are the environmental implications of using this technology in semiconductor manufacturing? ===

The abstract does not address the environmental impact of implementing this technology. It would be relevant to investigate if there are any sustainability benefits or concerns related to the materials and processes involved in semiconductor package assembly using interposer dies and chiplets.


==Original Abstract Submitted==

a semiconductor package assembly includes a package interface. an interposer die has a first surface and a second surface opposite to the first surface, where the first surface of the interposer is die positioned on the package interface. the interposer die includes a plurality of conductive connections between the first surface and second surface. a chiplet includes a connectivity region having conductive pathways, with a first portion of the connectivity region coupled to a conductive connection of the interposer die and a second portion of the connectivity region cantilevered from the interposer die.



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