View source for 20240079784.Electronic Device Having Compact Grounding Structure simplified abstract (apple inc.)

=Electronic Device Having Compact Grounding Structure=


==Organization Name==

[[:Category:apple inc.|apple inc.]]


[[Category:apple inc.]]

==Inventor(s)==

[[:Category:Han Wang of Campbell CA (US)|Han Wang of Campbell CA (US)]][[Category:Han Wang of Campbell CA (US)]]

[[:Category:Victor C. Lee of Santa Clara CA (US)|Victor C. Lee of Santa Clara CA (US)]][[Category:Victor C. Lee of Santa Clara CA (US)]]

[[:Category:Jingni Zhong of Santa Clara CA (US)|Jingni Zhong of Santa Clara CA (US)]][[Category:Jingni Zhong of Santa Clara CA (US)]]

[[:Category:Ming Chen of Cupertino CA (US)|Ming Chen of Cupertino CA (US)]][[Category:Ming Chen of Cupertino CA (US)]]

[[:Category:Bhaskara R. Rupakula of San Jose CA (US)|Bhaskara R. Rupakula of San Jose CA (US)]][[Category:Bhaskara R. Rupakula of San Jose CA (US)]]

[[:Category:Yiren Wang of Cupertino CA (US)|Yiren Wang of Cupertino CA (US)]][[Category:Yiren Wang of Cupertino CA (US)]]

[[:Category:Yuan Tao of Santa Clara CA (US)|Yuan Tao of Santa Clara CA (US)]][[Category:Yuan Tao of Santa Clara CA (US)]]

[[:Category:Christopher Q. Ma of San Francisco CA (US)|Christopher Q. Ma of San Francisco CA (US)]][[Category:Christopher Q. Ma of San Francisco CA (US)]]

[[:Category:Zhiheng Zhou of Zhangjiagang (CN)|Zhiheng Zhou of Zhangjiagang (CN)]][[Category:Zhiheng Zhou of Zhangjiagang (CN)]]

[[:Category:Sherry Cao of San Francisco CA (US)|Sherry Cao of San Francisco CA (US)]][[Category:Sherry Cao of San Francisco CA (US)]]

[[:Category:Kevin M. Froese of Verona WI (US)|Kevin M. Froese of Verona WI (US)]][[Category:Kevin M. Froese of Verona WI (US)]]

[[:Category:Hao Xu of Cupertino CA (US)|Hao Xu of Cupertino CA (US)]][[Category:Hao Xu of Cupertino CA (US)]]

[[:Category:Hongfei Hu of Cupertino CA (US)|Hongfei Hu of Cupertino CA (US)]][[Category:Hongfei Hu of Cupertino CA (US)]]

[[:Category:Mattia Pascolini of San Francisco CA (US)|Mattia Pascolini of San Francisco CA (US)]][[Category:Mattia Pascolini of San Francisco CA (US)]]

==Electronic Device Having Compact Grounding Structure - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240079784 titled 'Electronic Device Having Compact Grounding Structure

==Simplified Explanation==

An electronic device with a flexible printed circuit and a light source module mounted to a metal cowling is described in the patent application. The printed circuit is interposed between the cowling and a conductive support plate, with a ground trace coupled to the resonating element. A dimpled pad on the printed circuit presses against the support plate, forming a return path to ground for the resonating element.

* Antenna with resonating element
* Light source module mounted to flexible printed circuit and metal cowling
* Emitting light through rear housing wall
* Printed circuit interposed between cowling and support plate
* Ground trace coupled to resonating element
* Dimpled pad on printed circuit presses against support plate
* Compressive foam exerts force on printed circuit
* Dimpled pad forms return path to ground for resonating element
* Occupies less height than other structures

== Potential Applications ==
This technology could be applied in various electronic devices that require antennas and light sources, such as smartphones, tablets, and IoT devices.

== Problems Solved ==
This innovation solves the problem of efficiently integrating an antenna and a light source module in an electronic device while maintaining a compact design.

== Benefits ==
The benefits of this technology include improved space utilization, enhanced signal reception, and simplified manufacturing processes for electronic devices.

== Potential Commercial Applications ==
The potential commercial applications of this technology include consumer electronics, telecommunications equipment, and smart home devices.

== Possible Prior Art ==
One possible prior art for this technology could be the integration of antennas and light sources in electronic devices using separate components, which may result in a less efficient design.

=== Unanswered Questions ===

== How does the compressive foam impact the overall performance of the device? ==
The compressive foam is used to exert a force on the flexible printed circuit, but it is not clear how this may affect the functionality or durability of the device.

== What materials are used for the dimpled pad and how do they impact the performance of the device? ==
The materials used for the dimpled pad are not specified in the abstract, so it is unclear how they may affect the overall performance or reliability of the device.


==Original Abstract Submitted==

an electronic device may be provided with an antenna having a resonating element and a light source module mounted to a flexible printed circuit and a metal cowling. the module may emit light through a rear housing wall. the printed circuit may be interposed between the metal cowling and a conductive support plate in the rear housing wall. the printed circuit may include a ground trace coupled to the resonating element. a dimpled pad may couple the ground trace to the support plate. compressive foam may be used to exert a force against the flexible printed circuit that presses the dimpled pad against the conductive support plate. the ground trace and the dimpled pad may form a return path to ground for the resonating element. the dimpled pad may occupy less height within the device than other structures such as metal springs.



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