View source for 20240055350. ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS simplified abstract (Micron Technology, Inc.)

=ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS=


==Organization Name==

[[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]


[[Category:Micron Technology, Inc.]]

==Inventor(s)==

[[:Category:Mark S. Swenson of Meridian ID (US)|Mark S. Swenson of Meridian ID (US)]][[Category:Mark S. Swenson of Meridian ID (US)]]

[[:Category:Surendranath C. Eruvuru of Boise ID (US)|Surendranath C. Eruvuru of Boise ID (US)]][[Category:Surendranath C. Eruvuru of Boise ID (US)]]

[[:Category:Lifang Xu of Boise ID (US)|Lifang Xu of Boise ID (US)]][[Category:Lifang Xu of Boise ID (US)]]

==ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240055350 titled 'ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES ISOLATED BY SLOT STRUCTURES, AND RELATED SYSTEMS AND METHODS

==Simplified Explanation==

The electronic device described in the patent application comprises a stack with alternating conductive and insulative structures, as well as dielectric-filled slots extending vertically through the stack in different horizontal directions. Isolation structures are placed between the dielectric-filled slots to separate them and are positioned adjacent to the conductive and insulative structures in the stack.

* The electronic device includes a stack with alternating conductive and insulative structures.
* Dielectric-filled slots extend vertically through the stack in different horizontal directions.
* Isolation structures separate the dielectric-filled slots and are positioned adjacent to the conductive and insulative structures in the stack.

### Potential Applications
* Integrated circuits
* Semiconductor devices
* Electronic components

### Problems Solved
* Improved signal transmission
* Enhanced insulation between components
* Efficient use of space in electronic devices

### Benefits
* Increased performance of electronic devices
* Enhanced reliability
* Compact design for smaller devices


==Original Abstract Submitted==

an electronic device comprises a stack comprising an alternating sequence of conductive structures and insulative structures arranged in tiers, and at least one dielectric-filled slot extending vertically through the stack and extending in a first horizontal direction. the at least one dielectric-filled slot is defined between two internal sidewalls of the stack. the electronic device comprises additional dielectric-filled slots extending vertically through the stack and extending in a second horizontal direction transverse to the first horizontal direction, and isolation structures laterally interposed between the at least one dielectric-filled slot and the additional dielectric-filled slots. the isolation structures are laterally adjacent to the conductive structures of the stack, and at least some of the isolation structures are vertically adjacent to the insulative structures of the stack. related systems and methods of forming the electronic devices are also disclosed.



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