View source for 20240052206. ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE simplified abstract (LINTEC CORPORATION)

=ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE=


==Organization Name==

[[:Category:LINTEC CORPORATION|LINTEC CORPORATION]]


[[Category:LINTEC CORPORATION]]

==Inventor(s)==

[[:Category:Koji Tsuchibuchi of Itabashi-ku, Tokyo (JP)|Koji Tsuchibuchi of Itabashi-ku, Tokyo (JP)]][[Category:Koji Tsuchibuchi of Itabashi-ku, Tokyo (JP)]]

[[:Category:Naoki Taya of Itabashi-ku Tokyo (JP)|Naoki Taya of Itabashi-ku Tokyo (JP)]][[Category:Naoki Taya of Itabashi-ku Tokyo (JP)]]

==ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240052206 titled 'ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE

==Simplified Explanation==

The abstract describes a high-frequency dielectric heating adhesive that is designed to bond three or more adherends. The adhesive contains a thermoplastic resin and a dielectric filler that generates heat when a high-frequency electric field is applied. The MVR (Melt Volume Rate) of the adhesive is in a range from 1 to 300 cm/10 min, with the lower-limit temperature (tl) and upper-limit temperature (tu) defined by specific numerical formulas.

* The high-frequency dielectric heating adhesive is formulated to bond multiple adherends.
* It contains a thermoplastic resin and a dielectric filler that generates heat under a high-frequency electric field.
* The MVR of the adhesive is within a specific range, indicating its flowability and suitability for bonding applications.

Potential Applications:
* This adhesive can be used in various industries where bonding of multiple materials is required, such as automotive, aerospace, electronics, and construction.
* It can be used for bonding different types of materials, including metals, plastics, ceramics, and composites.

Problems Solved:
* The high-frequency dielectric heating adhesive provides a reliable and efficient bonding solution for joining multiple adherends.
* It eliminates the need for traditional heating methods, such as ovens or hot plates, by utilizing the heat generated through dielectric heating.
* The adhesive offers a fast and precise bonding process, reducing production time and costs.

Benefits:
* The adhesive allows for the bonding of three or more adherends, expanding the possibilities for complex assemblies.
* It provides a strong and durable bond, ensuring the integrity and longevity of the joined materials.
* The high-frequency dielectric heating process offers a more energy-efficient and environmentally friendly bonding method compared to conventional heating techniques.


==Original Abstract Submitted==

a high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. the high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. mvr of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature tl to an upper-limit temperature tu is in a range from 1 to 300 cm/10 min, where the lower-limit temperature tl (unit: degrees c.) is defined by a numerical formula (numerical formula 11) below and the upper-limit temperature tu (unit: degrees c.) is defined by a numerical formula (numerical formula 12) below,



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