View source for 20240049431. COMPLIANT COOLING PLATES simplified abstract (Transport Phenomena Technologies, LLC)

=COMPLIANT COOLING PLATES=


==Organization Name==

[[:Category:Transport Phenomena Technologies, LLC|Transport Phenomena Technologies, LLC]]


[[Category:Transport Phenomena Technologies, LLC]]

==Inventor(s)==

[[:Category:Georgios Karamanis of Medford MA (US)|Georgios Karamanis of Medford MA (US)]][[Category:Georgios Karamanis of Medford MA (US)]]

[[:Category:Marc Scott Hodes of Cambridge MA (US)|Marc Scott Hodes of Cambridge MA (US)]][[Category:Marc Scott Hodes of Cambridge MA (US)]]

==COMPLIANT COOLING PLATES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240049431 titled 'COMPLIANT COOLING PLATES

==Simplified Explanation==

The abstract describes a cooling plate that can accommodate variations in heat dissipation requirements across multiple components while efficiently transferring heat away from them. The cooling plate includes a housing, a diaphragm, ribs, and at least one fin. The housing and diaphragm define a chamber enclosed relative to a contact surface of the diaphragm. The ribs and fin define channels in the chamber. The fin is movable towards the housing in response to external pressure on the contact surface from heat-dissipating devices.

* The cooling plate accommodates static and dynamic variations in heat dissipation requirements.
* It efficiently transfers heat away from heat-dissipating components.
* The housing and diaphragm define a chamber enclosed relative to a contact surface of the diaphragm.
* The ribs and fin collectively define channels in the chamber.
* The fin is movable towards the housing in response to external pressure on the contact surface from heat-dissipating devices.

Potential Applications:
* Cooling electronic components in circuit packs.
* Cooling components in automotive systems.
* Cooling components in aerospace systems.

Problems Solved:
* Uneven heat dissipation across multiple components.
* Inefficient heat transfer from heat-dissipating components.

Benefits:
* Accommodates variations in heat dissipation requirements.
* Efficiently transfers heat away from components.
* Provides uniform cooling across multiple components.
* Can be used in various industries such as electronics, automotive, and aerospace.


==Original Abstract Submitted==

cooling plates are generally directed to accommodating static and dynamic variations in heat dissipation requirements across a plurality of heat-dissipating components while maintaining efficient transfer of heat away from the heat-dissipating components. for example, a cooling plate may include a housing, a diaphragm, a plurality of ribs, and at least one fin. the housing and the diaphragm may collectively define a chamber enclosed relative to a contact surface of the diaphragm. the plurality of ribs and the at least one fin collectively defining a plurality of channels in the chamber. the at least one fin may be coupled to the diaphragm in the chamber, and the at least one fin may be movable toward the housing (e.g., to define at least a portion of a subset of the plurality of channels) in response to external pressure on the contact surface from one or more heat-dissipating devices of a circuit pack.



[[Category:H05K7/20]]