View source for 20240047491. SENSOR PACKAGE STRUCTURE simplified abstract (TONG HSING ELECTRONIC INDUSTRIES, LTD.)

=SENSOR PACKAGE STRUCTURE=


==Organization Name==

[[:Category:TONG HSING ELECTRONIC INDUSTRIES, LTD.|TONG HSING ELECTRONIC INDUSTRIES, LTD.]]


[[Category:TONG HSING ELECTRONIC INDUSTRIES, LTD.]]

==Inventor(s)==

[[:Category:YU-WEN Lee of Taipei City (TW)|YU-WEN Lee of Taipei City (TW)]][[Category:YU-WEN Lee of Taipei City (TW)]]

[[:Category:LI-CHUN Hung of Hsin-Chu County (TW)|LI-CHUN Hung of Hsin-Chu County (TW)]][[Category:LI-CHUN Hung of Hsin-Chu County (TW)]]

==SENSOR PACKAGE STRUCTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240047491 titled 'SENSOR PACKAGE STRUCTURE

==Simplified Explanation==

The abstract of the patent application describes a sensor package structure that includes various layers and a package body. The layers include a substrate, a sensor chip, a light-curing layer, a light-permeable layer, a shielding layer, and a light filter layer. The package body is formed on the substrate. The shielding layer surrounds a sensing region of the sensor chip and has at least one light-permeable slot covered by the light filter layer. The sensor chip, the light-curing layer, the light-permeable layer, the light filter layer, and the shielding layer are embedded in the package body, which exposes at least part of the light-permeable layer.

* The sensor package structure includes multiple layers and a package body.
* The layers include a substrate, a sensor chip, a light-curing layer, a light-permeable layer, a shielding layer, and a light filter layer.
* The package body is formed on the substrate.
* The shielding layer surrounds the sensing region of the sensor chip.
* The shielding layer has at least one light-permeable slot covered by the light filter layer.
* The sensor chip, the light-curing layer, the light-permeable layer, the light filter layer, and the shielding layer are embedded in the package body.
* The package body exposes at least part of the light-permeable layer.

Potential applications of this technology:
* Sensor packages for various industries such as automotive, consumer electronics, medical devices, etc.
* Optical sensors requiring protection from external light interference.
* Sensing applications where precise control of light exposure is necessary.

Problems solved by this technology:
* Protection of the sensor chip from external light interference.
* Enhanced accuracy and reliability of sensor measurements by shielding the sensing region.
* Prevention of damage to the sensor chip from external factors.

Benefits of this technology:
* Improved performance and accuracy of sensors.
* Increased durability and lifespan of sensor packages.
* Enhanced functionality and versatility in various applications.
* Cost-effective solution for sensor packaging.


==Original Abstract Submitted==

a sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer disposed on the light-curing layer, a shielding layer disposed on an inner surface of the light-permeable layer, a light filter layer arranged between the light-curing layer and the shielding layer, and a package body that is formed on the substrate. a projection region defined by orthogonally projecting the shielding layer onto a top surface of the sensor chip surrounds a sensing region of the sensor chip. the shielding layer has at least one light-permeable slot being covered by the light filter layer. the sensor chip, the light-curing layer, the light-permeable layer, the light filter layer, and the shielding layer are embedded in the package body that exposes at least part of the light-permeable layer.



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