View source for 20240032425. MULTILEVEL THERMOELECTRIC COOLING STACK WITH THERMAL GUARD RINGS simplified abstract (UNIVERSITY OF MALTA)

=MULTILEVEL THERMOELECTRIC COOLING STACK WITH THERMAL GUARD RINGS=


==Organization Name==

[[:Category:UNIVERSITY OF MALTA|UNIVERSITY OF MALTA]]


[[Category:UNIVERSITY OF MALTA]]

==Inventor(s)==

[[:Category:Marc Anthony Azzopardi of San Gwann (MT)|Marc Anthony Azzopardi of San Gwann (MT)]][[Category:Marc Anthony Azzopardi of San Gwann (MT)]]

[[:Category:Andre Micallef of Birbirkara (MT)|Andre Micallef of Birbirkara (MT)]][[Category:Andre Micallef of Birbirkara (MT)]]

[[:Category:Alec Fenech of Swieqi (MT)|Alec Fenech of Swieqi (MT)]][[Category:Alec Fenech of Swieqi (MT)]]

==MULTILEVEL THERMOELECTRIC COOLING STACK WITH THERMAL GUARD RINGS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240032425 titled 'MULTILEVEL THERMOELECTRIC COOLING STACK WITH THERMAL GUARD RINGS

==Simplified Explanation==

The abstract describes a patent application for a multilevel thermoelectric cooling (TEC) stack that channels thermal power away from an element to be cooled, which is mounted on a substrate such as a circuit board. The TEC stack includes an inner TEC level in direct or indirect thermal contact with the element and an outer TEC level. At least one of the TEC levels includes a shaped thermal guard ring in thermal contact with the substrate. The thermal guard ring(s) define isothermal boundaries on the substrate and effectively channel thermal power away from the element to be cooled.

* The patent application describes a multilevel TEC stack for cooling an element mounted on a substrate.
* The TEC stack includes an inner TEC level in thermal contact with the element and an outer TEC level.
* At least one of the TEC levels includes a shaped thermal guard ring in thermal contact with the substrate.
* The thermal guard ring(s) define isothermal boundaries on the substrate and channel thermal power away from the element to be cooled.

Potential Applications:
* Cooling electronic components mounted on circuit boards.
* Cooling high-power devices such as power amplifiers or lasers.
* Cooling medical devices or equipment.
* Cooling automotive components.

Problems Solved:
* Efficiently cooling elements mounted on substrates.
* Managing and dissipating heat generated by elements.
* Preventing overheating and damage to electronic components.
* Improving the overall performance and reliability of devices.

Benefits:
* Enhanced cooling efficiency.
* Improved heat management and dissipation.
* Increased reliability and lifespan of electronic components.
* Compact and space-saving design.
* Potential for energy savings in cooling systems.


==Original Abstract Submitted==

a multilevel thermoelectric cooling (tec) stack channels thermal power away from an element to be cooled which is mounted on a substrate such as a circuit board and may generate an intrinsic heat load. the tec stack has an inner tec level which is in direct or indirect thermal contact with the element and an outer tec level. at least one of the tec levels includes a shaped thermal guard ring which is in thermal contact with the substrate. the thermal guard ring(s) define isothermal boundaries on the substrate, and effectively channel, or “wick”, thermal power away from the element to be cooled.



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