View source for 20240032185. Heat Sink Component Terminations simplified abstract (KYOCERA AVX Components Corporation)

=Heat Sink Component Terminations=


==Organization Name==

[[:Category:KYOCERA AVX Components Corporation|KYOCERA AVX Components Corporation]]


[[Category:KYOCERA AVX Components Corporation]]

==Inventor(s)==

[[:Category:Cory Nelson of Simpsonville SC (US)|Cory Nelson of Simpsonville SC (US)]][[Category:Cory Nelson of Simpsonville SC (US)]]

[[:Category:Marianne Berolini of Greer SC (US)|Marianne Berolini of Greer SC (US)]][[Category:Marianne Berolini of Greer SC (US)]]

[[:Category:Ronald Demcko of Raleigh NC (US)|Ronald Demcko of Raleigh NC (US)]][[Category:Ronald Demcko of Raleigh NC (US)]]

==Heat Sink Component Terminations - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240032185 titled 'Heat Sink Component Terminations

==Simplified Explanation==

The abstract describes a heat sink component that is made of a thermally conductive material but is electrically non-conductive. The component has two terminals formed on its surface, with a defined spacing distance between them. The ratio of the surface length to the terminal spacing distance is greater than 10, and the ratio of the body surface area to the total terminal area is less than 1.2. The component can be connected to a device with multiple terminals, specifically the heat source terminal and the heat sink terminal.

* The heat sink component is made of a material that can efficiently transfer heat.
* The component has two terminals on its surface, which can be used for connecting to other devices.
* The spacing distance between the terminals is important and has a specific ratio to the surface length.
* The body surface area of the heat sink component is smaller than the total terminal area.
* The heat sink component can be connected to a device with multiple terminals, specifically the heat source terminal and the heat sink terminal.

== Potential Applications ==
* Electronics cooling: The heat sink component can be used to dissipate heat generated by electronic devices, such as computer processors or power amplifiers.
* LED lighting: The heat sink component can be used to cool down high-power LED lights, ensuring their longevity and performance.
* Automotive industry: The heat sink component can be utilized in cooling systems for electric vehicles or hybrid cars, preventing overheating of critical components.

== Problems Solved ==
* Efficient heat dissipation: The heat sink component solves the problem of efficiently transferring heat away from heat-generating devices, preventing overheating and potential damage.
* Electrical insulation: The component being electrically non-conductive solves the problem of electrical short circuits or interference when connecting to other devices.

== Benefits ==
* Improved thermal management: The heat sink component allows for effective heat dissipation, improving the overall performance and lifespan of electronic devices.
* Versatile connectivity: The multiple terminals on the heat sink component provide flexibility in connecting to various devices, ensuring compatibility.
* Electrical safety: The electrically non-conductive nature of the component ensures the prevention of electrical accidents or damage when connecting to other devices.


==Original Abstract Submitted==

a heat sink component can include a body including a thermally conductive material that is electrically non-conductive. at least one first terminal can be formed over a surface of the body. at least one second terminal can be formed over the surface of the body. a terminal spacing distance can be defined along the surface between the first terminal and the second terminal. a ratio of a length of the surface to the terminal spacing distance can be greater than about 10. additionally or alternatively, a ratio of the area of the at least one body surface to the total terminal area can be less than 1.2. a component assembly can include a device having a plurality of terminals exposed on a top surface, and the heat source terminal and the heat sink terminal of the heat sink component can be connected with respective terminals of the device.



[[Category:H05K1/02]]