View source for 20240026560. MICROSTRUCTURAL SURFACE INCORPORATION OF PHASE CHANGE MATERIALS FOR THERMAL MANAGEMENT simplified abstract (THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY)

=MICROSTRUCTURAL SURFACE INCORPORATION OF PHASE CHANGE MATERIALS FOR THERMAL MANAGEMENT=


==Organization Name==

[[:Category:THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY|THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY]]


[[Category:THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY]]

==Inventor(s)==

[[:Category:Claudia Catalina Luhrs of Pacific Grove CA (US)|Claudia Catalina Luhrs of Pacific Grove CA (US)]][[Category:Claudia Catalina Luhrs of Pacific Grove CA (US)]]

[[:Category:Forest Douglas Shaner of San Jose CA (US)|Forest Douglas Shaner of San Jose CA (US)]][[Category:Forest Douglas Shaner of San Jose CA (US)]]

[[:Category:Christopher James Anderson of Louisville NE (US)|Christopher James Anderson of Louisville NE (US)]][[Category:Christopher James Anderson of Louisville NE (US)]]

==MICROSTRUCTURAL SURFACE INCORPORATION OF PHASE CHANGE MATERIALS FOR THERMAL MANAGEMENT - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240026560 titled 'MICROSTRUCTURAL SURFACE INCORPORATION OF PHASE CHANGE MATERIALS FOR THERMAL MANAGEMENT

==Simplified Explanation==

The patent application describes a process for protecting an article from thermal damage. Here is a simplified explanation of the abstract:

* Anodizing a metallic surface of the article to create a layer of metal oxide.
* Annealing the anodic layer to enhance its properties.
* Introducing a phase change material into the pores formed by the anodic layer.
* Applying a seal layer to seal the phase change material within the pores.

Potential applications of this technology:

* Protection of electronic components from thermal damage.
* Thermal management in aerospace and automotive industries.
* Heat dissipation in power electronics.
* Thermal insulation in buildings and infrastructure.

Problems solved by this technology:

* Preventing thermal damage to sensitive components.
* Enhancing heat dissipation and thermal management.
* Improving the efficiency and reliability of electronic devices.
* Reducing the risk of overheating and system failures.

Benefits of this technology:

* Increased lifespan and reliability of electronic devices.
* Improved thermal performance and efficiency.
* Enhanced safety by preventing thermal damage.
* Cost-effective solution for thermal management.


==Original Abstract Submitted==

a process for protecting an article from thermal damage includes anodizing a metallic surface of the article to form an anodic layer containing a metal oxide; annealing the anodic layer; introducing a phase change material to pores defined by the anodic layer; and applying a seal layer to seal the phase change material within the pores.



[[Category:C25D11/24]]