View source for 20240025735. METHODS FOR ULTRASONIC FABRICATION AND SEALING OF MICROFLUIDICS simplified abstract (NATIONAL CENTRE FOR SCIENTIFIC RESEARCH "DEMOKRITOS")

=METHODS FOR ULTRASONIC FABRICATION AND SEALING OF MICROFLUIDICS=


==Organization Name==

[[:Category:NATIONAL CENTRE FOR SCIENTIFIC RESEARCH "DEMOKRITOS"|NATIONAL CENTRE FOR SCIENTIFIC RESEARCH "DEMOKRITOS"]]


[[Category:NATIONAL CENTRE FOR SCIENTIFIC RESEARCH "DEMOKRITOS"]]

==Inventor(s)==

[[:Category:Evangelos Gogolides of Agia Paraskevi (GR)|Evangelos Gogolides of Agia Paraskevi (GR)]][[Category:Evangelos Gogolides of Agia Paraskevi (GR)]]

[[:Category:Kosmas Ellinas of Agia Paraskevi (GR)|Kosmas Ellinas of Agia Paraskevi (GR)]][[Category:Kosmas Ellinas of Agia Paraskevi (GR)]]

[[:Category:George Boulousis of Agia Paraskevi (GR)|George Boulousis of Agia Paraskevi (GR)]][[Category:George Boulousis of Agia Paraskevi (GR)]]

==METHODS FOR ULTRASONIC FABRICATION AND SEALING OF MICROFLUIDICS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240025735 titled 'METHODS FOR ULTRASONIC FABRICATION AND SEALING OF MICROFLUIDICS

==Simplified Explanation==

The patent application describes a method for manufacturing a microfluidic device that includes an inflexible polymeric substrate, one or more flexible polymeric substrates, and one or more microfluidic channels enclosed between the substrates. The method involves the following steps:

1. Providing a master form that has rim protrusions defining the shape of the microfluidic channel(s) to be produced and enclosed between the substrates.
2. Placing one or more flexible polymeric substrates, each with a layer thickness of less than 800 μm, onto the master form. One of the flexible polymeric substrates is in contact with the rim protrusions of the master form.
3. Placing an inflexible polymeric substrate with a layer thickness of equal to or more than 800 μm onto the flexible polymeric substrate(s).
4. Ultrasonically welding the flexible polymeric substrate(s) and the inflexible polymeric substrate at the rim protrusions.

The innovation in this method is that it allows for the production of microfluidic devices via ultrasonic welding without the need for energy directors. Ultrasonic welding is a fast and efficient method for joining thermoplastic materials, and by eliminating the need for energy directors, the manufacturing process is simplified.

Potential applications of this technology include:

- Lab-on-a-chip devices: Microfluidic devices are commonly used in the field of lab-on-a-chip technology, where they enable the integration of multiple laboratory functions onto a single chip. This method can be used to manufacture microfluidic devices for various applications, such as chemical analysis, medical diagnostics, and drug discovery.

- Biomedical research: Microfluidic devices are used in biomedical research for tasks such as cell sorting, DNA analysis, and drug screening. The simplified manufacturing process provided by this technology can make microfluidic devices more accessible and cost-effective for researchers.

- Industrial applications: Microfluidic devices have potential applications in various industries, including pharmaceuticals, food and beverage, and environmental monitoring. This method can be used to manufacture microfluidic devices for tasks such as quality control, process optimization, and monitoring of chemical reactions.

The problems solved by this technology include:

- Simplified manufacturing process: The method eliminates the need for energy directors, which are typically used in ultrasonic welding to ensure proper joining of the substrates. This simplifies the manufacturing process and reduces the complexity and cost of producing microfluidic devices.

- Enhanced flexibility: By using flexible polymeric substrates, the resulting microfluidic devices have increased flexibility, allowing for easier integration into different systems and applications.

- Improved sealing: The ultrasonic welding at the rim protrusions ensures a secure and leak-proof enclosure of the microfluidic channels, improving the reliability and performance of the devices.

The benefits of this technology include:

- Cost-effectiveness: The simplified manufacturing process reduces the production costs of microfluidic devices, making them more affordable and accessible for various applications.

- Versatility: The method allows for the production of microfluidic devices with different shapes and configurations, enabling customization for specific applications.

- Improved performance: The ultrasonic welding at the rim protrusions ensures a strong and reliable bond between the substrates, enhancing the durability and performance of the microfluidic devices.

- Scalability: The method can be easily scaled up for mass production, enabling the efficient manufacturing of large quantities of microfluidic devices.


==Original Abstract Submitted==

method of manufacturing a microfluidic device comprising an inflexible polymeric substrate, one or more flexible polymeric substrate(s) and one or more microfluidic channel(s) enclosed between the substrates comprising a) providing a master form including rim protrusions defining an enveloping shape for the microfluidic channel(s) to be produced and enclosed between the substrates, b) placing one or more flexible polymeric substrate(s) each having a layer thickness of less than 800 �m onto the master form, wherein one flexible polymeric substrate is in contact with the rim protrusions of the master form, c) placing an inflexible polymeric substrate with a layer thickness of equal to or more than 800 �m onto the flexible polymeric substrate(s), and d) ultrasonically welding the one or more flexible polymeric substrate(s) and the inflexible polymeric substrate at the rim protrusions. by the inventive method microfluidic devices via ultrasonic welding without using energy directors can be obtained.



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