View source for 20240022179. ENHANCED INTEGRATION OF POWER INVERTERS USING POLYMER COMPOSITE ENCAPSULATION simplified abstract (GM GLOBAL TECHNOLOGY OPERATIONS LLC)

=ENHANCED INTEGRATION OF POWER INVERTERS USING POLYMER COMPOSITE ENCAPSULATION=


==Organization Name==

[[:Category:GM GLOBAL TECHNOLOGY OPERATIONS LLC|GM GLOBAL TECHNOLOGY OPERATIONS LLC]]


[[Category:GM GLOBAL TECHNOLOGY OPERATIONS LLC]]

==Inventor(s)==

[[:Category:Anthony Michael Coppola of Rochester Hills MI (US)|Anthony Michael Coppola of Rochester Hills MI (US)]][[Category:Anthony Michael Coppola of Rochester Hills MI (US)]]

[[:Category:Erik Brandon Golm of Warren MI (US)|Erik Brandon Golm of Warren MI (US)]][[Category:Erik Brandon Golm of Warren MI (US)]]

[[:Category:Alireza Fatemi of Canton MI (US)|Alireza Fatemi of Canton MI (US)]][[Category:Alireza Fatemi of Canton MI (US)]]

[[:Category:Ming Liu of Shanghai (CN)|Ming Liu of Shanghai (CN)]][[Category:Ming Liu of Shanghai (CN)]]

[[:Category:Seongchan Pack of West Bloomfield Township MI (US)|Seongchan Pack of West Bloomfield Township MI (US)]][[Category:Seongchan Pack of West Bloomfield Township MI (US)]]

[[:Category:Muhammad Hussain Alvi of Troy MI (US)|Muhammad Hussain Alvi of Troy MI (US)]][[Category:Muhammad Hussain Alvi of Troy MI (US)]]

[[:Category:Ronald O. Grover, Jr. of Northville MI (US)|Ronald O. Grover, Jr. of Northville MI (US)]][[Category:Ronald O. Grover, Jr. of Northville MI (US)]]

==ENHANCED INTEGRATION OF POWER INVERTERS USING POLYMER COMPOSITE ENCAPSULATION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240022179 titled 'ENHANCED INTEGRATION OF POWER INVERTERS USING POLYMER COMPOSITE ENCAPSULATION

==Simplified Explanation==

The abstract describes a power control system for an electric vehicle that includes a power inverter with a switch module, a controller board, and a gate driver board. The system also includes a first housing made of polymer composite, which encloses the power inverter and defines a cooling cavity in thermal communication with a surface of the switch module. The housing also encapsulates a portion of at least one of the switch module, the controller board, and the gate driver board.

* The power control system is designed for use in electric vehicles.
* It includes a power inverter with a switch module, a controller board, and a gate driver board.
* The switch module comprises multiple power switches.
* The gate driver board is in communication with the controller board and is responsible for driving the gates of the power switches.
* The first housing, made of polymer composite, encloses the power inverter and provides thermal communication with the switch module.
* The housing also encapsulates a portion of the switch module, the controller board, and the gate driver board.

Potential applications of this technology:

* Electric vehicles: The power control system can be used in electric vehicles to efficiently control the power flow and ensure optimal performance.

Problems solved by this technology:

* Heat dissipation: The first housing, with its cooling cavity, helps dissipate heat generated by the power inverter and switch module, preventing overheating and ensuring reliable operation.

Benefits of this technology:

* Improved efficiency: The power control system, with its power inverter and switch module, allows for efficient control of power flow in electric vehicles, resulting in improved overall efficiency.
* Enhanced reliability: The encapsulation of the switch module, controller board, and gate driver board within the housing helps protect them from external elements, increasing the reliability and lifespan of the power control system.


==Original Abstract Submitted==

a power control system for an electric vehicle includes a power inverter comprising a switch module including a plurality of power switches, a controller board, and a gate driver board in communication with the controller board and configured to drive gates of the plurality of switches. a first housing is made of polymer composite, encloses the power inverter, defines a first cooling cavity in thermal communication with a first surface of the switch module, and encapsulates a portion of at least one of the switch module, the controller board and the gate driver board.



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