View source for 20240017373. MEMBRANE FOR CARRIER HEAD WITH SEGMENTED SUBSTRATE CHUCK simplified abstract (APPLIED MATERIALS, INC.)

=MEMBRANE FOR CARRIER HEAD WITH SEGMENTED SUBSTRATE CHUCK=


==Organization Name==

[[:Category:APPLIED MATERIALS, INC.|APPLIED MATERIALS, INC.]]


[[Category:APPLIED MATERIALS, INC.]]

==Inventor(s)==

[[:Category:Steven M. Zuniga of Soquel CA (US)|Steven M. Zuniga of Soquel CA (US)]][[Category:Steven M. Zuniga of Soquel CA (US)]]

[[:Category:Jay Gurusamy of Santa Clara CA (US)|Jay Gurusamy of Santa Clara CA (US)]][[Category:Jay Gurusamy of Santa Clara CA (US)]]

==MEMBRANE FOR CARRIER HEAD WITH SEGMENTED SUBSTRATE CHUCK - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240017373 titled 'MEMBRANE FOR CARRIER HEAD WITH SEGMENTED SUBSTRATE CHUCK

==Simplified Explanation==

The abstract describes a membrane for a CMP (Chemical Mechanical Polishing) carrier head, which is used in the semiconductor manufacturing process. The membrane consists of a circular lower portion that acts as a mounting surface for a substrate, a first set of flaps that extend upward from the circular lower portion to create inner chambers, an annular upper portion that provides a lower surface for applying pressure to the outer region of the substrate, and a second set of flaps that extend upward from the annular upper portion to create independently pressurizable outer chambers. The annular upper portion surrounds the circular lower portion and is vertically offset from it, with the lower surface positioned above the circular lower portion. The annular upper portion is coupled to the outermost flap of the first set of flaps.

* The membrane is designed to be used in a CMP carrier head for semiconductor manufacturing.
* It provides a substrate mounting surface and creates inner and outer chambers.
* The annular upper portion applies pressure to the outer region of the substrate.
* The membrane is vertically offset, allowing for the lower surface to be positioned above the circular lower portion.
* The annular upper portion is coupled to the outermost flap of the first set of flaps.

Potential Applications:
* Semiconductor manufacturing processes that involve CMP (Chemical Mechanical Polishing).
* Used in CMP carrier heads to hold and polish substrates.

Problems Solved:
* Provides a stable and efficient substrate mounting surface.
* Creates inner and outer chambers for pressure distribution during polishing.
* Allows for independent pressurization of the outer chambers.

Benefits:
* Improved polishing performance and uniformity.
* Enhanced control over pressure distribution.
* Increased stability and reliability during the CMP process.


==Original Abstract Submitted==

a membrane for a cmp carrier head includes a circular lower portion that provides a substrate mounting surface for a central region of a substrate, a first plurality of flaps that extend upward from the circular lower portion to form a plurality of inner chambers, an annular upper portion that provides a lower surface for applying pressure to an annular outer region of the substrate, and a second plurality of flaps that extend upward from the annular upper portion to form a plurality of independently pressurizable outer chambers. the annular upper portion surrounds the circular lower portion and is vertically offset from the circular lower portion such that the lower surface is positioned above a plane defined by the circular lower portion, and the annular upper portion is coupled to an outermost flap of the first plurality of flaps.



[[Category:B24B37/32]]