View source for 20240010489. MEMS DEVICE COMPRISING A DEFORMABLE STRUCTURE AND MANUFACTURING PROCESS OF THE MEMS DEVICE simplified abstract (STMICROELECTRONICS S.r.l.)

=MEMS DEVICE COMPRISING A DEFORMABLE STRUCTURE AND MANUFACTURING PROCESS OF THE MEMS DEVICE=


==Organization Name==

[[:Category:STMICROELECTRONICS S.r.l.|STMICROELECTRONICS S.r.l.]]


[[Category:STMICROELECTRONICS S.r.l.]]

==Inventor(s)==

[[:Category:Manuel Riani of Como (IT)|Manuel Riani of Como (IT)]][[Category:Manuel Riani of Como (IT)]]

[[:Category:Gabriele Gattere of CASTRONNO (IT)|Gabriele Gattere of CASTRONNO (IT)]][[Category:Gabriele Gattere of CASTRONNO (IT)]]

[[:Category:Federico Vercesi of Milano (IT)|Federico Vercesi of Milano (IT)]][[Category:Federico Vercesi of Milano (IT)]]

==MEMS DEVICE COMPRISING A DEFORMABLE STRUCTURE AND MANUFACTURING PROCESS OF THE MEMS DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240010489 titled 'MEMS DEVICE COMPRISING A DEFORMABLE STRUCTURE AND MANUFACTURING PROCESS OF THE MEMS DEVICE

==Simplified Explanation==

The abstract describes a MEMS (Micro-Electro-Mechanical System) device that includes a semiconductor body with a main cavity and an anchorage structure. It also includes a first deformable structure that is fixed to the anchorage structure and suspended over the main cavity. The second end of the first deformable structure is configured to oscillate along a second axis. The first deformable structure has a main body with a piezoelectric structure extending over its first outer surface. The main body has a top portion and a bottom portion that delimit a first buried cavity aligned with the piezoelectric structure along the second axis.

* The device is a MEMS device with a suspended deformable structure.
* The deformable structure is fixed to an anchorage structure and oscillates along a second axis.
* The main body of the deformable structure has a top portion and a bottom portion with different thicknesses.
* The top portion of the main body delimits a buried cavity aligned with the piezoelectric structure.

Potential applications of this technology:
* Micro-actuators for precise positioning or movement in various industries such as robotics, aerospace, and medical devices.
* Micro-sensors for detecting and measuring physical quantities like acceleration, pressure, or temperature.
* Micro-mirrors for optical applications such as beam steering or image stabilization.

Problems solved by this technology:
* Provides a compact and efficient way to control and manipulate micro-scale structures.
* Enables precise and controlled oscillation or movement along a specific axis.
* Enhances the sensitivity and accuracy of micro-sensors by utilizing piezoelectric properties.

Benefits of this technology:
* Miniaturization: The MEMS device allows for the integration of complex functionalities in a small form factor.
* Energy efficiency: The use of piezoelectric materials enables the conversion of mechanical energy into electrical energy, reducing power consumption.
* High precision: The ability to control and manipulate the deformable structure allows for precise and accurate movements or measurements.


==Original Abstract Submitted==

a mems device comprising: a semiconductor body defining a main cavity and forming an anchorage structure; and a first deformable structure having a first end and a second end that are opposite to one another along a first axis, the first deformable structure being fixed to the anchorage structure via the first end so as to be suspended over the main cavity. the second end is configured to oscillate, with respect to the anchorage structure, along a second axis. the first deformable structure comprises a main body having a first outer surface and a second outer surface, and a piezoelectric structure, which extends over the first outer surface. the main body comprises a bottom portion and a top portion that delimit along the second axis a first buried cavity aligned with the piezoelectric structure along the second axis, wherein a maximum thickness of the top portion of the main body along the second axis is smaller than a minimum thickness of the bottom portion of the main body along the second axis.



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